Resources Contact Us Home
Integrated circuit package and method of manufacturing same

Image Number 5 for United States Patent #8035216.

Decoupling capacitors are frequently used in computer systems in order to control noise. In general, decoupling capacitors are placed as close as possible to the devices they protect in order to minimize the amount of line inductance and series resistance between the devices and the capacitors. An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate. The presence of a recess in the substrate provides an opportunity to reduce the separation distance between a die supported by the die platform and the decoupling capacitors. A further advantage of embodiments of the invention lies in its ability to maintain socket compatibility.

  Recently Added Patents
Image reading apparatus
Proximity-based mobile message delivery
Motion blur reduction for LCD video/graphics processors
Display system with mounting assemblies and associated methods
Damage resistant antenna
Controller with screen
Real-time demand prediction in a fast service restaurant environment
  Randomly Featured Patents
Insulated container for storing liquid helium
Modular power converters usable alone or in a multiphase power converter
Valve stem and valve plug apparatus for use with fluid regulators
Wedge-type rope socket connection and method
Sharpness testing of micro-objects such as miniature diamond tool tips
Liquid dispenser and docking station for mating container
Voltage regulator
Marine lifting apparatus
Method and system for identifying telemarketer communications
Color picture tube having shadow mask with improved tie bar grading