Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit package and method of manufacturing same










Image Number 5 for United States Patent #8035216.

Decoupling capacitors are frequently used in computer systems in order to control noise. In general, decoupling capacitors are placed as close as possible to the devices they protect in order to minimize the amount of line inductance and series resistance between the devices and the capacitors. An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate. The presence of a recess in the substrate provides an opportunity to reduce the separation distance between a die supported by the die platform and the decoupling capacitors. A further advantage of embodiments of the invention lies in its ability to maintain socket compatibility.








 
 
  Recently Added Patents
Medicament delivery device and a method of medicament delivery
Signal routing dependent on a loading indicator of a mobile node
Method and system for delivering and executing virtual container on logical partition of target computing device
Semiconductor power amplifier
Sensor packages and method of packaging dies of differing sizes
Battery pack with interchangeable circuit substrates
Microfluidic cartridge and method of using same
  Randomly Featured Patents
Driver or bit construction
Process for preparing diaryl carbonate
Photochemical synthesis of metallic nanoparticles for ink applications
Ultrasonic wave reception apparatus and obstacle detection apparatus
Burn-in socket having actuating mechanism strengthening contact to facilitate electrical interconnection
Transportable-expandable mobile home structure
Cryptographic communication with mobile devices
Manufacturing method of a transparent conductive film, a manufacturing method of a transparent electrode of an organic electroluminescence device, an organic electroluminescence device and the
Integrated live and simulation environment system for an aircraft
Disk drive using rotational position optimization algorithm to facilitate write verify operations