Resources Contact Us Home
Integrated circuit package and method of manufacturing same

Image Number 5 for United States Patent #8035216.

Decoupling capacitors are frequently used in computer systems in order to control noise. In general, decoupling capacitors are placed as close as possible to the devices they protect in order to minimize the amount of line inductance and series resistance between the devices and the capacitors. An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate. The presence of a recess in the substrate provides an opportunity to reduce the separation distance between a die supported by the die platform and the decoupling capacitors. A further advantage of embodiments of the invention lies in its ability to maintain socket compatibility.

  Recently Added Patents
Navigation apparatus, search result display method, and graphical user interface
Soybean cultivar CL0911444
Azole derivatives, methods for producing the same, intermediate thereof, agro-horticultural agents
Wound dressing with a discontinuous contact layer surface
Web-based system and method for video analysis
Storage system, control method therefor, and program
Method, apparatus, and system for synchronizing contents
  Randomly Featured Patents
Method and system for testing video
Plasma display apparatus
Electronic map display declutter
Board game
Waterless flush toilet system
Writing instrument with system for selecting lotto numbers
Process for preparing a bisphenol
Method for fabricating a semiconductor device including exposing a group III-V semiconductor to an ammonia plasma
Marker screw cap
Hydraulic braking pressure control system for vehicle