Resources Contact Us Home
Chip cooling channels formed in wafer bonding gap

Image Number 4 for United States Patent #8030754.

One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.

  Recently Added Patents
Transfer of digital data through an isolation
Inkjet ink
Multilayered ceramic electronic component and fabrication method thereof
Tungsten barrier and seed for copper filled TSV
Press nut
Image reading apparatus and image forming apparatus
  Randomly Featured Patents
Output regulation circuit of a power converter without current sensing loss and method thereof
Device to read in bed or when reclining
Method and mechanism for processing image data
Extensible file and path renaming during multimedia acquisition
Nonwoven laminated fabrics
Locating elements of construction beneath the surface of earth soils
Bed transfer system
Elastic, breathable, barrier fabric
Apparatus and method for connecting components
Laser diode