Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip cooling channels formed in wafer bonding gap










Image Number 4 for United States Patent #8030754.

One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.








 
 
  Recently Added Patents
Apparatus and method of managing radio bearer in wireless communication system
Side portion of a circular saw blade
Systems and methods for identifying similar documents
Polar nematic compounds
Position-measuring device
System and method for providing private demand-driven pricing
Light-emitting element, light-emitting device, and electronic device
  Randomly Featured Patents
Capacitance-to-voltage transformation circuit
Concrete formwork and method for forming a draft tube
Seamless stainless steel sink bowl with a grid ledge
Data security arrangements for semiconductor programmable devices
Headset
Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
Query processing system and method for database with encrypted column by query encryption transformation
Device for interconnection and protection of a bare microwave component chip
Pressure swing adsorption process
Ethylene-styrene copolymers and phenol-triazole type complexes, catalysts, and processes for polymerizing