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Chip cooling channels formed in wafer bonding gap










Image Number 2 for United States Patent #8030754.

One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.








 
 
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