Resources Contact Us Home
Heat treatment method for preventing substrate deformation

Image Number 4 for United States Patent #8030225.

A heat treatment method which can prevent heat deformation of a substrate caused during a heat treatment process on the substrate with a thin film formed on its surface is provided. The heat treatment method in accordance with the present invention includes (a) stacking a second substrate 10b on a first substrate 10a; and (b) stacking a weight 20 on the second substrate 10b, wherein the first substrate 10a and the second substrate 10b are stacked, with thin films 12 of the substrates 10a and 10b being in contact with each other. In accordance with the present invention, deformation of the substrate can be prevented by stacking the substrates, with thin films formed on the substrates being in contact with each other, and placing a weight on the stacked substrates during the heat treatment process.

  Recently Added Patents
Display screen with graphical user interface
Epoxy composition for encapsulating an optical semiconductor element
Apparatus for generating electrical energy from rocking activated energy
Method of adenoviral vector synthesis
Steering wheel
Instrumenting configuration and system settings
High purity diphenyl sulfone, preparation and use thereof for the preparation of a poly(aryletherketone)
  Randomly Featured Patents
Yarns and fibers good properties, based on atactic polyvinyl chloride, and process for the production
Soda crackers
Sheet member feeding cassette
Polyethylene glycol derivative
Methods for treating skin pigmentation
Ultrasonically welded pompons
Beam directing system and method for use in a charged particle beam column
Melting scrap metal and ingestion of solids in molten metal
Connection structure and connector means for a cable/pipe bed
Method and apparatus for measuring and precisely locating internal tensile stresses in hardened regions of components by measuring coercive field strength and barkhausen noise amplitude