Resources Contact Us Home
Heat treatment method for preventing substrate deformation

Image Number 4 for United States Patent #8030225.

A heat treatment method which can prevent heat deformation of a substrate caused during a heat treatment process on the substrate with a thin film formed on its surface is provided. The heat treatment method in accordance with the present invention includes (a) stacking a second substrate 10b on a first substrate 10a; and (b) stacking a weight 20 on the second substrate 10b, wherein the first substrate 10a and the second substrate 10b are stacked, with thin films 12 of the substrates 10a and 10b being in contact with each other. In accordance with the present invention, deformation of the substrate can be prevented by stacking the substrates, with thin films formed on the substrates being in contact with each other, and placing a weight on the stacked substrates during the heat treatment process.

  Recently Added Patents
Reovirus for the treatment of cellular proliferative disorders
Persistent luminescence nanoparticles used in the form of a diagnosis agent for in vivo optical imaging
Fuel cell stack including ejector and blower for anode recirculation and method for controlling the same
Methods for processing 2Nx2N block with N being positive integer greater than four under intra-prediction mode and related processing circuits thereof
Tetrazolyl oxime derivative, salt thereof, and plant disease control agent
Methods and systems to accomplish variable width data input
  Randomly Featured Patents
Polyvinylbutyral films which contain plasticizer and have a reduced adhesive power on glass
Analog/digital data storage system
High tenacity polyethylene-2, 6-naphthalate fibers having excellent processability
Hydraulic valve
Single-shaft combined plant
Transcutaneous analyte sensor
Osteotomy guide
Electromagnetic unit fuel injector
Piezoelectrically controlled superconducting switch
Method and apparatus for publishing hypermedia documents over wide area networks