Resources Contact Us Home
Break-open package with shaped die cut for storing and dispensing substrates

Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.

  Recently Added Patents
Print system
Methods, systems and computer program products for importing data from an edge router to a network management system
Summarization of short comments
Pharmaceutical composition for treating CAPRIN-1 expressing cancer
Method and a channel estimating arrangement for performing channel estimation
Organic light-emitting display with black matrix
Playback device for stereoscopic viewing, integrated circuit, and program
  Randomly Featured Patents
Transport chain for form-fill packaging apparatus
Direct mail advertising booklet and method of production
Liquid crystal display and manufacturing method thereof
Scanner device and control method thereof, and image input system
Retractable camera
Mold material with additives
Device for managing data in a version
Television receiver suitable for multi-standard operation and method therefor
Replaceable shoulder padding for football and the like
Convertible aerial vehicle with contra-rotating wing/rotors and twin tilting wing and propeller units