Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Break-open package with shaped die cut for storing and dispensing substrates Image Number 5 for United States Patent #8028837. A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.       Recently Added Patents Lens barrel, driving method thereof, and image pickup device Control of an exhaust gas aftertreatment device in a hybrid vehicle Optical fibre connector Protection circuit for protecting a half-bridge circuit Memory device with robust write assist Method for tracking changes in virtual disks Multi-dimensional price determination   Randomly Featured Patents Synthetic polymers having hydrogen bonding capability and containing polysiloxane moieties Metal to plastic pipe transition fitting Methods and systems for treating presbyopia Earring Electro-optic vision system which exploits position and attitude Optical fiber amplifier and optical transmission system using the same Memory device with pipelined address path Adjustable caulk dispensing gun Valve for automatic brake system Golf bag with foam organizer © 2006-2008 PatentGenius. All Rights Reserved.