Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
  Recently Added Patents
Method and apparatus of motion vector prediction with extended motion vector predictor
Measuring device and measuring method that use pulsed electromagnetic wave
Approaching object detection system
Method, apparatus, computer program, and computer readable storage media for controlling the insertion of tab sheets into a print job
Method and system for delivering and executing virtual container on logical partition of target computing device
Image forming apparatus
Color image forming apparatus with contact control of process units
  Randomly Featured Patents
Single-crystal material based on aluminium garnets
Method and apparatus for reducing borehole and eccentricity effects in multicomponent induction logging
Method and apparatus for gas detection based on spectral spatial misregistration
Thermal cutoff fuse for arbitrary temperatures
Simulation of digital circuits
Loop filter with noise cancellation
Portable device for accessing host computer via remote computer
Double center luffing crane
Axially aligned, commonly joined dual dispensers
Digital delay-locked loop circuits with hierarchical delay adjustment