Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
  Recently Added Patents
Highly stiff and highly damping cast iron
Video recording management
Light transmission system with optical waveguide
Method and apparatus for answering and recording automatically in visual telephone service
Multi-carrier signal transmitter and multi-carrier signal receiver
Hard disk drive module
Cathodic materials for use in electrochemical sensors and associated devices and methods of manufacturing the same
  Randomly Featured Patents
Three function control mechanism
Semiconductor device and method for producing the same
Human receptor proteins; related reagents and methods
Capacitance measurement system and method
Cobalt-chromium dental alloys containing ruthenium and aluminum
Dual mode drum brake device
Apparatus for adjusting and controlling the position of a trolling motor relative to a watercraft
Protective cape
Snow tire stud removing tool
Evaluation systems and methods for coordinating software agents