Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
  Recently Added Patents
Developer cartridge for image-forming device
Mini wave exerciser
Integrated circuit packaging system with support structure and method of manufacture thereof
Method and apparatus for treating tissue
Variety corn line NPID3719
Method and apparatus for channel coding and decoding in a communication system using a low-density parity-check code
Method and apparatus for gastrointestinal tract ablation for treatment of obesity
  Randomly Featured Patents
Steam iron
Scroll saw
Image display device, drive circuit device and defect detection method of light-emitting diode
Display device
Method for regulating fuel flow into a turbine
Nonlinear vacuum spark advance system
Apparatus and method for grinding needle workpieces
Battery monitor apparatus
Color based lock and key
Semiconductor sensor