Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
  Recently Added Patents
Electric train drive control device
LED illumination systems
Landscape post for solar and other light fixtures
Method and system for shared high speed cache in SAS switches
Scanned image projection system employing intermediate image plane
Polymer composites having highly dispersed carbon nanotubes
Integrated circuit testing with power collapsed
  Randomly Featured Patents
Nonlinear amplifier calibration system and methods
Resonant converter
Engine side guard mounting
Display device
Liquid crystal projector, and projection lens unit, optical unit and cooling system for the same
Fixture for abrasive cloth paper
Indexing conveyor for robotic production operations
Inbred corn plant MBZA
Method and apparatus for stacking tortilla chips
Therapeutic post-operative leg elevator