Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
  Recently Added Patents
Carrier sense multiple access (CSMA) protocols for power line communications (PLC)
Integrated multi-sat LNB and frequency translation module
Use of emerging non-volatile memory elements with flash memory
Phosphor adhesive sheet, light emitting diode element including phosphor layer, light emitting diode device, and producing methods thereof
Die packages and systems having the die packages
Discharge lamp comprising coated electrode
(4928
  Randomly Featured Patents
Receptacle, such as an ashtray, glove compartment or the like for vehicles
Method and apparatus for aligning multiple laser beams
Process of strengthening dilute phosphoric acid
Electronic telephone directory dialer module
Plate joiner
Substituted aromatic thiocarboxylic acid amides and their use as herbicides
Enhancement of activity and/or duration of action of soft anti-inflammatory steroids for topical or other local application
Whirlpool bathtub
Record material cutting mechanism
Pole scrubber