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Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
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