Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
  Recently Added Patents
Compact multi-functional scanning apparatus with retractable flatbed scanner
Video processing system and device with encoding and decoding modes and method for use therewith
Providing multiple decode options for a system-on-chip (SoC) fabric
Image forming apparatus
Packet transmission system and fault recovery method
Activated carbon cryogels and related methods
Method and system for checking citations
  Randomly Featured Patents
On-board aircraft auxiliary power systems having dual auxiliary power units
Portable gyratory compactor and extruder with a single pivot and two gyration actuators
Dispenser
Multi-chip module having content addressable memory
Microwave ablation generator control system
Beam chair
SRAM bitline pull-up MOSFET structure for internal circuit electro-static discharge immunity
X-ray tube for producing a high-efficiency beam and especially a pencil beam
Gaming machine with win change symbol
Projection exposure apparatus and method