Resources Contact Us Home
Break-open package with shaped die cut for storing and dispensing substrates

Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.

  Recently Added Patents
Dual source mass spectrometry system
Defensin polynucleotides and methods of use
Method and system for testing indirect bandgap semiconductor devices using luminescence imaging
Display for gloves
Lightning-protective explosion-preventive fastener
Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
Method for playing digital media files with a digital media player using a plurality of playlists
  Randomly Featured Patents
Pharmaceuticals and method for making them
Latch mechanism for safety belts
Multi-laser system
Handling device for power working machine
Roof bracket assembly
Microwave delay equalizer comprising a pair of distributed-constant_ elements as a directional coupler
Absorbent article having unitary waistcap and waistband
Nonreusable medical device with front retraction
Anode active material, method of manufacturing the same, and lithium battery using the same
Synchronizing ring