Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Break-open package with shaped die cut for storing and dispensing substrates










Image Number 5 for United States Patent #8028837.

A package that is opened by deforming or bending the package along the die cut on the surface of the package is disclosed. The package will fracture or break at a die cut providing an opening in the package to access the contents inside. The package is formed with a semi-rigid layer affixed to a flexible backing layer forming an inner cavity. A die cut extends from at least an area adjacent one edge of the semi-rigid layer to at least an area adjacent another edge of the semi-rigid layer to provide a fracture point for the package to break. At least a portion of the die cut extends along both the lateral width and the longitudinal width of the semi-rigid layer to allow a greater surface area of the substrate to be accessible. Thus, dispensing of the substrate is easier for the user.








 
 
  Recently Added Patents
Regenerative braking control to mitigate powertrain oscillation
Systems, computer programs, and methods for controlling costs of a healthcare practice
Production of battery grade materials via an oxalate method
Accessing a base station
Method for isomerisation of hop alpha-acids using heterogeneous alkaline earth metal based catalysts
Method of reducing acetaldehyde in polyesters, and polyesters therefrom
Aperture stop
  Randomly Featured Patents
Exterior shell of a vehicle hood
Pattern display implement and container with screen part
Image forming apparatus
Digital signal clamp circuitry
Device for supplying fuel from supply tank to internal combustion engine of motor vehicle
Nucleic acid encoding melanoma differentiation associated gene-9
Bracket for removably mounting a mud flap assembly
Electrographic transfer roller drive mechanism
Hydrostatic transmission
LED device having a humidity sensor