Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of grinding wafer










Image Number 8 for United States Patent #8025556.

A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.








 
 
  Recently Added Patents
Trivet
Resist composition, method of forming resist pattern, novel compound, and acid generator
Motor vehicle radar system, and method for determining speeds and distances of objects
Adhesive composition for self-adhesive label and item including the same
Scatter correction methods
Haptic feedback case for electronic equipment
Retinal prosthesis techniques
  Randomly Featured Patents
Internal combustion engine valve drive switching device
Thermosetting binder prepared with (hydroxyalkyl)urea crosslinking agent for abrasive articles
Hybrid maize plant and seed 37M34
Method for the operation of wind power plants
Recombinant antibodies specific for a growth factor receptor
Die storage container
Thermoplastic sheet forming apparatus and method
Electrical connector having a shell with a holding portion and a releasing portion
Maintenance and repair station for charging cars of coke oven batteries
Focus area change circuit