Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of grinding wafer










Image Number 8 for United States Patent #8025556.

A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.








 
 
  Recently Added Patents
Messenger bag
Electronic apparatus and manufacturing method of electronic apparatus
Method for culturing lactic acid bacterium and method for producing fermented milk
Image scanning apparatus and image forming apparatus
System and apparatus for control of published content
(4930
Information display device and program storing medium
  Randomly Featured Patents
Battery control system for hybrid vehicle and method for controlling a hybrid vehicle battery
Method and apparatus for adjusting phase of internal clock signal
Dual layer barrier film techniques to prevent resist poisoning
Illumination intensity correcting circuit
Apparatus and method for exhausting liquid crystal material from a liquid crystal display by heated air
Network failure detecting method and device
Wideband antenna
Methyl isocyanate emission control
Method for preserving blood using ascorbic acid tocopheryl phosphate esters
Multilayer inductor and method of manufacturing the same