Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of grinding wafer










Image Number 8 for United States Patent #8025556.

A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.








 
 
  Recently Added Patents
Communication device and communication method
Emergency communications system
Optical sensor
Mobile phone
Registration of emission tomography and computed tomography
Music theory device
System and method for adaptively configuring an L2 cache memory mesh
  Randomly Featured Patents
Multichannel optical waveguide page scanner with individually addressable electro-optic modulators
Alkoxylated modified Mannich condensates and manufacture of rigid polyurethane foams therewith
Infantometer for measuring height of infants
Method of producing yeast fermented beverages
Thawing-heating tray and thawing-heating method
Walking aid device
Dynamic real-time magnetic resonance imaging sequence designer
Method and system for managing data at an input/output interface for a multiprocessor system
Anti-lock braking system with nonback driveable actuator
Configurable aerial vehicle aerosurface