Resources Contact Us Home
Method of grinding wafer

Image Number 8 for United States Patent #8025556.

A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.

  Recently Added Patents
Touch panel structure and manufacturing method thereof
Method and apparatus for rebuilding data in a dispersed data storage network
Power or voltage oscillation damping in a power transmission system
Method and apparatus for sensing an input object relative to a sensing region of an ultrasound sensor device
Mobile communication method, mobile station, and network device
Sheet coil type resolver
Methods and systems for creating a tail risk hedge index and trading derivative products based thereon
  Randomly Featured Patents
Delay-locked loop, integrated circuit having the same, and method of driving the same
Continuous content sharing through intelligent resolution of federated hierarchical graphs
Decorative penile wrap
Zoom lens system
Universal non-progressive reward for live casino games
Caulk gun
Protection structure for flexible flat cable
Toggle lock
Leather tanning process using aluminium (III) and titanium (IV) complexes
Damper mechanism for nuclear reactor control elements