Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Surface acoustic wave device, module device, oscillation circuit, and method for manufacturing surface acoustic wave device










Image Number 13 for United States Patent #8018122.

An SH wave type surface acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and constituted of Al or an alloy mainly containing Al and that uses a SH wave as an excitation wave. The piezoelectric substrate is a crystal plate in which a cut angle .theta. of a rotary Y cut quartz substrate is set in a range of -64.0.degree.<.theta.<-49.3.degree. in a counter-clockwise direction from a crystal axis Z and in which a surface acoustic wave propagation direction is set at 90.degree..+-.5.degree. with respect to a crystal axis X. An electrode film thickness H/.lamda. standardized by a wavelength of the IDT electrode is 0.04<H/.lamda.<0.12, where .lamda. is a wavelength of the surface acoustic wave to be excited, and a main surface of the piezoelectric substrate is etched by a thickness of 0.002 .mu.m or more.








 
 
  Recently Added Patents
System, method and program product for guiding correction of semantic errors in code using collaboration records
Neurostimulation system
Emergency power-off button with proximity alarm
Server system and method for discovering digital assets in enterprise information systems
Bicycle shifting method
Systems and methods for picture based communication
Preservation of liquid foods
  Randomly Featured Patents
Dental chair operating apparatus
Method for producing connecting elements for electrically joining microelectronic components
Mycoherbicide and method for controlling Calamagrostis canadensis
Armament system and explosive charge construction therefor
Electrical and mechanical coupling for model rail sections
Process for forming an acoustic monitoring device
Camera lens assembly for portable terminal
Injectable opacifying composition containing liposomes of high encapsulating capacity for X-ray examinations
Efficient fiber coupling of light to interferometric instrumentation
Electroacoustical transducing