Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor package having side walls and method for manufacturing the same










Image Number 13 for United States Patent #8018043.

A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces of the semiconductor chip and expose the bonding pads. Re-distribution lines are placed on the first insulation layer pattern and include first re-distribution line parts and second re-distribution line parts. The first re-distribution line parts have an end connected with the bonding pads and correspond to the upper surface of the semiconductor chip and the second re-distribution line parts extend from the first re-distribution line parts beyond the side surfaces of the semiconductor chip. A second insulation layer pattern is formed over the semiconductor chip and exposes portions of the first re-distribution line parts and the second re-distribution line parts.








 
 
  Recently Added Patents
Statistical information collection from one or more device(s) in storage communication with a computing platform
Solar cell using polymer-dispersed liquid crystals
Methods and compositions for wound healing
Measurement of an analyte on the skin using a hue angle
Process to extract quassinoids
Output circuit
Transmission channel for ultrasound applications
  Randomly Featured Patents
Binocular system with automatic diopter power adjustment
Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition
Strobe flash lamp power supply with input voltage feedthrough afterflow prevention circuit
Folding anchor
Method and apparatus for reducing setups during test, mark and pack operations
Retroviral vector having an ovalbumin promoter
Method and means of assimilating utility meter data
Nucleic acid molecules encoding a transmembrane serine protease 7, the encoded polypeptides and methods based thereon
Digital power meter communication system, method and computer-readable storage medium for storing thereof
Modular outdoor heating system