Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor package having side walls and method for manufacturing the same










Image Number 13 for United States Patent #8018043.

A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces of the semiconductor chip and expose the bonding pads. Re-distribution lines are placed on the first insulation layer pattern and include first re-distribution line parts and second re-distribution line parts. The first re-distribution line parts have an end connected with the bonding pads and correspond to the upper surface of the semiconductor chip and the second re-distribution line parts extend from the first re-distribution line parts beyond the side surfaces of the semiconductor chip. A second insulation layer pattern is formed over the semiconductor chip and exposes portions of the first re-distribution line parts and the second re-distribution line parts.








 
 
  Recently Added Patents
Method of processing data and display apparatus for performing the method
Method and system for automatically identifying wireless signal quality of a region
Spatula
High-speed comparator with asymmetric frequency response
Portable multimedia player
Inter-carrier communications for multimedia-message delivery
Fuel cell module, manufacturing method thereof and unit containing several of the latter
  Randomly Featured Patents
Method of and apparatus for steering a mining machine
Method and apparatus for operating networked gaming devices
Rigidizer for plastic vessels
Methods for decreasing beta amyloid protein
Novelty attachment for a drinks receptacle
4-aminopyrimidine derivatives
Golf swing improvement device
Water purification and dispensing system
Enzymes responsible for the metabolism of cis-zeatin
Use of extract of cimicifuga racemosa