Resources Contact Us Home
Method for stress free conductor removal

Image Number 16 for United States Patent #8017516.

A system and method for forming a planar dielectric layer includes identifying a non-planarity in the dielectric layer, forming one or more additional dielectric layers over the dielectric layer and planarizing at least one of the additional dielectric layers wherein the one or more additional dielectric layers include at least one of a spin-on-glass layer and at least one of a low-k dielectric material layer and wherein each one of the one or more additional dielectric layers having a thickness of less than about 1000 angstroms and wherein the one or more additional dielectric layers has a total thickness of between about 1000 and about 4000 angstroms.

  Recently Added Patents
Multicolored light converting LED with minimal absorption
Low latency interrupt collector
Method to dynamically tune precision resistance
Resistor and manufacturing method thereof
Benzimidazole inhibition of biofilm formation
Portable, single member housing cord protector
  Randomly Featured Patents
Electrochemical cells having hydrogen gas absorbing agent
Process and apparatus for the dispersion and proportioning of fibers used in the building sector in general
Solid-state image pickup device
Tap head for beverage containers or barrels
One touch voice memo
Outboard motor lock
Method of recovery of printing ink wastes
Method of labelling soya varieties
Anti-eclipsing circuit for image sensors
Combinative type slip ring