Resources Contact Us Home
Method for stress free conductor removal

Image Number 16 for United States Patent #8017516.

A system and method for forming a planar dielectric layer includes identifying a non-planarity in the dielectric layer, forming one or more additional dielectric layers over the dielectric layer and planarizing at least one of the additional dielectric layers wherein the one or more additional dielectric layers include at least one of a spin-on-glass layer and at least one of a low-k dielectric material layer and wherein each one of the one or more additional dielectric layers having a thickness of less than about 1000 angstroms and wherein the one or more additional dielectric layers has a total thickness of between about 1000 and about 4000 angstroms.

  Recently Added Patents
Methods and systems for motion estimation with nonlinear motion-field smoothing
High gradient lens for charged particle beam
Information processing apparatus and method
Rapid glycopeptide optimization via neoglycosylation
Pet burial pod
Method, apparatus, and system for energy efficiency and energy conservation including dynamic cache sizing and cache operating voltage management for optimal power performance
Semiconductor device and method for manufacturing same
  Randomly Featured Patents
Set top box device and method of distributing multimedia content
Microfluidic device having a flow channel
Automated manual transmission shift methodology for tanker trucks
Trailer based collision warning system and method
Bed enclosure
Method and system for enhanced packet transmission in cellular networks
System and method for page navigation visualization and analysis
Rotary transformer
Wall shelf
Stationary sliding bar