Resources Contact Us Home
Method for stress free conductor removal

Image Number 16 for United States Patent #8017516.

A system and method for forming a planar dielectric layer includes identifying a non-planarity in the dielectric layer, forming one or more additional dielectric layers over the dielectric layer and planarizing at least one of the additional dielectric layers wherein the one or more additional dielectric layers include at least one of a spin-on-glass layer and at least one of a low-k dielectric material layer and wherein each one of the one or more additional dielectric layers having a thickness of less than about 1000 angstroms and wherein the one or more additional dielectric layers has a total thickness of between about 1000 and about 4000 angstroms.

  Recently Added Patents
Header rail for a shower screen or the like
Content display monitor
Method for designing sunlight-reflection and heat-radiation multilayer film
Statistical information collection from one or more device(s) in storage communication with a computing platform
Focusing apparatus that effectively sets a focus area of an image when a focusing mode is changed
Dithering method and apparatus
  Randomly Featured Patents
Long box packaging design for prerecorded media
Adjustable mechanism for a seat back of a stroller
Electrical connector incorporating EMI/RFI/EMP isolation
Aqueous coating compositions containing flatting agents and low molecular weight polyethers
Shock energy absorbing mechanism in tilt lock device
Stabilized tablet formulation
Heat assembly and method of transferring heat
Sacrificial agents for enhanced oil recovery
Ankle joint bandage
Method and apparatus for transferring toner