Resources Contact Us Home
Method of manufacturing semiconductor device in which functional portion of element is exposed

Image Number 7 for United States Patent #7998781.

A method of manufacturing a semiconductor device includes: forming a first resin layer on a wafer having a light receiving portion; patterning the first resin layer into a predetermined shape and forming a first resin film on the light receiving portion; dividing the wafer into light receiving elements; mounting the light receiving elements on an upper surface of a lead frame; a sealing step of forming a sealing resin layer around the first resin film; and removing the first resin film such that a portion of the light receiving element is exposed to the outside, and in the sealing step, the upper surface of the first resin film is flush with the upper surface of the sealing resin layer, or the upper surface of the first resin film is higher than the upper surface of the sealing resin layer.

  Recently Added Patents
Method and system for producing fluoride gas and fluorine-doped glass or ceramics
Heteroleptic iridium complexes as dopants
Matching engine for comparing data feeds with user profile criteria
Lateral flow test kit and method for detecting an analyte
Illumination apparatus
Image decolorizing device
  Randomly Featured Patents
Communications system, communications device, and data retransmission control method
Electron beam sterilization method
Programmable turbine speed controller
Coal refining
Supply chain multi-dimensional serial containment process
Microwave oven control with external memory control data
Generating vector displacement maps using parameterized sculpted meshes
Cable attachment
Hybrid semiconductor electronic device having multiple material layers
Method and apparatus for switching optical signals with a photon band gap device