Resources Contact Us Home
Method of measuring pose of mobile robot and method and apparatus for measuring position of mobile robot using the same

Image Number 13 for United States Patent #7996179.

A method of measuring pose of mobile robot, and method and apparatus for measuring for measuring position of mobile robot using the same are provided. The apparatus for measuring the pose of a mobile robot includes an accelerometer measuring acceleration of the mobile robot in a forward direction, a uniform-motion-determining unit determining whether the mobile robot belongs to a uniform motion section, an acceleration section, or a deceleration section, and a pose-calculating unit calculating a pitch and a roll of the mobile robot in the uniform motion section, using the relationship between the measured acceleration in the forward direction and the acceleration due to gravity.

  Recently Added Patents
Efficient relay automatic repeat request procedure in broadband wireless access system
System and method to obtain signal acquisition assistance data
Apparatus and methods for providing efficient space-time structures for preambles, pilots and data for multi-input, multi-output communications systems
Method of manufacturing nitride semiconductor and nitride semiconductor element
System and method for self service marketing research
Method and apparatus for storing email messages
Control of protein activity using a conducting polymer
  Randomly Featured Patents
System and method for a process attribute based computer network filter
Connectors, display frame apparatus and method of use
Adhesive tape
Globally-convergent geo-location algorithm
Television signal converter for converting a high definition television signal into a television signal for display by a standard television receiver
Fastening device
Use of semi-interpenetrating polymer networks for cable/fiber retention
Method for generating overexpression of alleles in genes of unknown function
Method of marking ophthalmic lenses of organic material and lenses so marked
Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield