Resources Contact Us Home
High-density patterning

Image Number 8 for United States Patent #7994052.

Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset configured to form a plurality of lines over the substrate, and patterning a second subset of the pattern, the second subset configured to form a plurality of islands over the substrate, wherein said patterning the first subset and said patterning the second subset comprise at least two separate patterning operations.

  Recently Added Patents
Linear transformer power supply
Lubricating oil compositions
Method of providing user-tailored entertainment experience at hospitality location and hospitality media system thereof
TC-83-derived alphavirus vectors, particles and methods
Color stable manganese-doped phosphors
Modular connector for touch sensitive device
Translation system adapted for query translation via a reranking framework
  Randomly Featured Patents
Post passivation interconnection schemes on top of the IC chips
14-Functionalized 8,19-oxido steroids and processes for preparation thereof
Apparatus for stuffing at least one insert into printed products
Key container
Rope lock
Antenna array
Liquid crystal device with ferroelectric liquid crystal oriented at non-pixel portions
Shared code caching for program code conversion
Antiviral 2,3-bis-(aryl)-3-chloropropenal compounds
Group packet encapsulation and compression system and method