Resources Contact Us Home
High-density patterning

Image Number 8 for United States Patent #7994052.

Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset configured to form a plurality of lines over the substrate, and patterning a second subset of the pattern, the second subset configured to form a plurality of islands over the substrate, wherein said patterning the first subset and said patterning the second subset comprise at least two separate patterning operations.

  Recently Added Patents
Internal wiring structure of semiconductor device
Method and system for encrypting data in a wireless communication system
Organic dual-gate memory and method for producing same
Tread portion of an automobile tire
Structural plasticity in spiking neural networks with symmetric dual of an electronic neuron
System and method for managing a loyalty program via an association network infrastructure
Polymers derived from benzobis(silolothiophene) and their use as organic semiconductors
  Randomly Featured Patents
Method and apparatus for establishing clear wireless communication
Power seat slide device
Charger unit
Apparatus for the retrieval and refiling of documents in flat file storage drawers
Universally programmable variable length decoder
Reflection and refraction optical system and projection exposure apparatus using the same
Shin guard
Automated order and delivery system
Apparatus for detecting the vibration of electrode wires and canceling the vibration thereof
Method of chemical protection of metal surface