Resources Contact Us Home
High-density patterning

Image Number 8 for United States Patent #7994052.

Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset configured to form a plurality of lines over the substrate, and patterning a second subset of the pattern, the second subset configured to form a plurality of islands over the substrate, wherein said patterning the first subset and said patterning the second subset comprise at least two separate patterning operations.

  Recently Added Patents
Method for using directing cells for specific stem/progenitor cell activation and differentiation
Semiconductor integrated circuit
Systems and methods for excluding undesirable network transactions
Calcium carbonate granulation
Scalable header extension
Mobile device case with storage compartment
Enhancing user experiences using aggregated device usage data
  Randomly Featured Patents
Greeting card in a transparent box
Sound projection system
Oligonucleotide N3'-P5' phosphoramidates: hybridization and nuclease resistance properties
Carnation plant named Ace High
Recuperative furnace
Process for the simultaneous fabrication of high-and-low-voltage semiconductor devices, integrated circuit containing the same, systems and methods
Mass spectrometer
Antidepressant (3-aryl-2,3-dihydrobenzofuran-3-yl)alkylamines
Method and apparatus for adaptively retiming and regenerating digital pulse signals
Speaker cabinet