Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor device and fabrication method thereof










Image Number 3 for United States Patent #7993970.

A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.








 
 
  Recently Added Patents
Controller interface providing improved data reliability
Editing device and editing method
Selecting content for storage in a multi-device cache
Methods for predicting cardiac toxicity
Analog-to-digital converter control using signal objects
Maize hybrid X08B748
Nonvolatile memory device
  Randomly Featured Patents
3,3'-spiroindolinone derivatives
Method for operating a wind energy installation
Control of network plug-and-play compliant device
Coated articles demonstrating heat reduction and noise reduction properties
H.323 to SIP interworking for call forward/redirection
Helicopter cargo hook
On-off valves and pressure regulators for high-pressure fluids
Control for an electromagnetic brake for a multiple-ratio power transmission that has a neutral switch for power take-off engagement
Medical device including structure for crossing an occlusion in a vessel
Bomber board game and method of playing