Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor device and fabrication method thereof










Image Number 3 for United States Patent #7993970.

A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.








 
 
  Recently Added Patents
Vertical axis wind turbines
System and method for improving text input in a shorthand-on-keyboard interface
Polypeptides and immunizing compositions containing gram positive polypeptides and methods of use
2,4-disubstituted pyrimidines useful as kinase inhibitors
Pointing device, display apparatus and pointing system, and location data generation method and display method using the same
Method and system for remapping processing elements in a pipeline of a graphics processing unit
Continuous geospatial tracking system and method
  Randomly Featured Patents
Method and apparatus for decision feedback equalization with reduced convergence time
Photometer with modular light emitter
Metal complexes derivatized with folate for use in diagnostic and therapeutic applications
Laser configuration
Multi-speed retainer
Feedforward amplifier
Fire control mechanism for an automatic pistol
Easily assembled barbecue grill with detachable accessory shelf and side burner
Thickening agents for unsaturated polyester resin compositions
Mesh pacifier