Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor device and fabrication method thereof










Image Number 3 for United States Patent #7993970.

A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.








 
 
  Recently Added Patents
Resin composition and display device using the same
Output queued switch with a parallel shared memory, and method of operating same
Processor micro-architecture for compute, save or restore multiple registers, devices, systems, methods and processes of manufacture
Food safety printer
Determining phase-specific parameters of a physiological variable
Metal halide lamps with fast run-up and methods of operating the same
Progressively discovering and integrating services
  Randomly Featured Patents
Electro-optic voltage sensor for sensing voltage in an E-field
Unitary interconnection structures integral with a dielectric layer
Pop-up straw for juvenile drinking cup
Casting steel strip
Topical compositions containing tea tree oil for treatment of viral lesions
Parameter optimization in sleep apnea treatment apparatus
Method of fabricating liquid crystal display with increased aperture ratio
Peel-apart-developable light-sensitive materials and image-forming method using the same
Exercise vibration plate machine
Electric resistance welded steel pipe with excellent weld toughness for line pipe