Resources Contact Us Home
Semiconductor device and fabrication method thereof

Image Number 3 for United States Patent #7993970.

A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.

  Recently Added Patents
Thermostat user interface
Image forming apparatus controlling toner image overlapping ratio
Methods for enhancing digital search query techniques based on task-oriented user activity
Spectrally efficient photodiode for backside illuminated sensor
Display control apparatus and display control method
Method and system for identifying subrogation potential and valuing a subrogation file
Low-CTE, lightweight hybrid materials with high durability in outspace
  Randomly Featured Patents
Method, system and article of manufacture for rolling back past a boundary generator to a savepoint located in a unit of work
Arm restraint for blood sampling
Insulating alkenyl aromatic polymer foam
Vehicle acceleration/deceleration warning system
Information processing system and network logging information processing method
Storage medium for estimating and improving test case generation
UZM-7 aluminosilicate zeolite, method of preparation and processes using UZM-7
Vacuum tank construction
Optical fiber coupling connector
Boat seat release system