Resources Contact Us Home
Semiconductor device and fabrication method thereof

Image Number 3 for United States Patent #7993970.

A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.

  Recently Added Patents
Non-serialized electronic product registration system and method of operating same
Laboratory spatula
Battery-operated massager and soap dispensing wand
System and method for deriving cell global identity information
Digital broadcast receiver and method for processing caption thereof
Power management method for reducing power of host when turning off main monitor and computer system applying the same
Managing and collaborating with digital content
  Randomly Featured Patents
Angle indicating attachment for drills
Parallax panning of mobile device desktop
Systems and methods for managing power consumption and performance of a processor
Cremation vase
Hair clip
Hydroxamic acid and pharmaceutical preparations containing the same
Preparing tertiary amine from formaldehyde and primary and/or secondary amine
Device for injecting ultrasonic waves into a medium
Scannable flip-flop with hold time improvements
Automated wagering recognition system