Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Fusion bonding process and structure for fabricating silicon-on-insulation (SOI) semiconductor devices










Image Number 4 for United States Patent #7989894.

A method of fabricating a semiconductor-on-insulator device including: providing a first semiconductor wafer having an about 500 angstrom thick oxide layer thereover; etching the first semiconductor wafer to raise a pattern therein; doping the raised pattern of the first semiconductor wafer through the about 500 angstrom thick oxide layer; providing a second semiconductor wafer having an oxide thereover; and, bonding the first semiconductor wafer oxide to the second semiconductor wafer oxide at an elevated temperature.








 
 
  Recently Added Patents
Method and assembly for determining the temperature of a test sensor
Client-managed group communication sessions within a wireless communications system
Amide derivatives, process for preparation thereof and use thereof as insecticide
Semiconductor device
Rotating-body electrification mechanism, image carrier unit, process cartridge, image forming apparatus, and method for electrifying image carrier unit
Flat panel display device and stereoscopic display device
Printed circuit board unit having routing unit mounted thereon and computer device having the same
  Randomly Featured Patents
Radiation curable coating compositions for superconducting wire
Pyrazolo (1,5-c) quinazoline derivatives and related compounds
Hole-blocking device
Self-cleaning shape memory retaining valve
Pharmaceutical compounds
Method of removing mercury from hydrocarbon oils
Method of customizing an article
Foamed metal preformed body
Benzo and benzothiopyranoindazole N-oxides
Method for fabricating fully silicided gate