Resources Contact Us Home
Method and system for thermally processing a plurality of wafer-shaped objects

Image Number 9 for United States Patent #7977258.

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.

  Recently Added Patents
Reovirus for the treatment of cellular proliferative disorders
Coordinate measuring device and method for measuring with a coordinate measuring device
Sub-LUN input/output profiling for SSD devices
Non-zero rounding and prediction mode selection techniques in video encoding
Cryptographic key split combiner
Bandpass filter and radio communication module and radio communication device using the same
Portable multimedia player
  Randomly Featured Patents
Toner composition for organic black matrix and preparation method thereof
Silencer for rear mounted bus air conditioner
Spinel optoceramics
Pedestal washing machine
Apparatus for washing the window glass of a vehicle
Automobile rear bumper
Gateway system for voice communication and controlling method thereof
Process for preparing oxazine ring compounds
Method for vaccum assisted preforming of superplastically or quick plastically formed article
Filing system and method for avoiding filing of identical document data