Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method and system for thermally processing a plurality of wafer-shaped objects










Image Number 9 for United States Patent #7977258.

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.








 
 
  Recently Added Patents
Adaptive block pre-fetching method and system
Late loading rich media
Method or system for investing and/or trading
Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
Methods of isolating bipotent hepatic progenitor cells
Titanium compounds and complexes as additives in lubricants
Method and apparatus for monitoring for a radio link failure
  Randomly Featured Patents
Grinder with built-in grinding agent dispenser
Outboard engine unit
Double weft/warp airbag fabric and related airbags and manufacturing methods
Bisacodyl dosage form with multiple enteric polymer coatings for colonic delivery
Method for forming recessed regions of thermally oxidized silicon and structures thereof utilizing anisotropic etching
Dispensing device for a liquid medicament
Method and apparatus for producing bends in optical fibers
Radio transmitter with an external antenna
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices
Readout apparatus for a ring laser angular rate sensor