Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method and system for thermally processing a plurality of wafer-shaped objects










Image Number 9 for United States Patent #7977258.

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.








 
 
  Recently Added Patents
Position-measuring device
Rotating device
Coordinate measuring device and method for measuring with a coordinate measuring device
Cosmetic/dermatological compositions comprising naphthoic acid compounds and polyurethane polymers
Compounds for nonsense suppression and methods for their use
Optical multiplexer/demultiplexer
Electric vehicle supply equipment having a socket and a method of charging an electric vehicle
  Randomly Featured Patents
Footwear sole component with a single sealed chamber
Wiping system for wiping a window, particularly for motor vehicle window pane and method of assembling same
Recycled product distribution support apparatus and program
Nonvolatile semiconductor memory device and manufacturing method thereof
Reduced cavity module with interchangeable seat
Recording apparatus
Process for producing, jointly or otherwise, monoalkyl aromatic compounds, dialkyl aromatic compounds and trialkyl aromatic compounds
Joint mechanism for structural members
Surgical anti-friction device
Method of feeding a rubber-consumer device with rubber, and an installation for feeding the rubber-consumer device with rubber