Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method and system for thermally processing a plurality of wafer-shaped objects










Image Number 9 for United States Patent #7977258.

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.








 
 
  Recently Added Patents
Touch-sensitive device and communication device
Systems and methods for reducing narrow bandwidth interference contained in broad bandwidth signals
Semiconductor device and method of adjusting characteristic thereof
Cosmetic/dermatological compositions comprising naphthoic acid compounds and polyurethane polymers
Load balancing for parallel tasks
Pre-sealing unit for wire-cut electric discharge machine
Opportunistic modem
  Randomly Featured Patents
Scroll sawing machine
Method of securing a machine element and/or a load connected to the machine element in a fixed position
Mainframe-based business rules engine construction tool
Unsaturated compounds containing carbamate terminal groups or urea terminal groups
Durability of adhesively bonded aluminum structures and method for inhibiting the conversion of aluminum oxide to aluminum hydroxide
Printed circuit board with header for magnetics all mounted to mother board
Reconfigurable personal display system and method
Semiconductor device with warp preventing board joined thereto
Electrical junction device
Dual pawl ratchet mechanism and reversing method