Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor wafer including cracking stopper structure and method of forming the same










Image Number 7 for United States Patent #7977232.

A semiconductor wafer may include, but is not limited to, the following elements. A semiconductor substrate has a device region and a dicing region. A stack of inter-layer insulators may extend over the device region and the dicing region. Multi-level interconnections may be disposed in the stack of inter-layer insulators. The multi-level interconnections may extend in the device region. An electrode layer may be disposed over the stack of inter-layer insulators. The electrode layer may extend in the device region. The electrode layer may cover the multi-level interconnections. A cracking stopper groove may be disposed in the dicing region. The cracking stopper groove may be positioned outside the device region.








 
 
  Recently Added Patents
Methods for integrating the production of cellulose nanofibrils with the production of cellulose nanocrystals
Personal warming apparatus
System and method for oscillator frequency control
Techniques for determining optimized local repair paths
Mobile device case with storage compartment
Rewriting branch instructions using branch stubs
Rotation angle sensor
  Randomly Featured Patents
Low dust wall repair compound
Cloning, expression and use of acid lysophospholipases
Control system and method for water supply
Dual-pressure electronic paintball gun
Apparatus and method for preparing radioactive medicines for administration
Permanent magnet and method of production
Method of wet-cleaning sintered silicon carbide
Liquid discharge head, method of manufacturing the liquid discharge head, and liquid discharge recording apparatus using the liquid discharge head
Intelligent mechatronic control suspension system based on soft computing
Method and system for appending search strings with user profile qualities