Resources Contact Us Home
Semiconductor wafer including cracking stopper structure and method of forming the same

Image Number 7 for United States Patent #7977232.

A semiconductor wafer may include, but is not limited to, the following elements. A semiconductor substrate has a device region and a dicing region. A stack of inter-layer insulators may extend over the device region and the dicing region. Multi-level interconnections may be disposed in the stack of inter-layer insulators. The multi-level interconnections may extend in the device region. An electrode layer may be disposed over the stack of inter-layer insulators. The electrode layer may extend in the device region. The electrode layer may cover the multi-level interconnections. A cracking stopper groove may be disposed in the dicing region. The cracking stopper groove may be positioned outside the device region.

  Recently Added Patents
Protection circuit
Systems and methods for enrolling consumers in goods and services
Liquid suspension concentrate formulations containing saflufenacil
Method for simultaneous transmitter operation
Non-browning apple, method for producing the same, and drink and food using the same
Flexible energy filter for ion beam therapy
Process for recovering ethanol
  Randomly Featured Patents
Discrimination method of target base in DNA, and allele specific primer used in the method of the same
Pest control device and method
Plastic closure retained by snapping over bottle neck bead
Transmission fluid heating using engine exhaust
Method and device for plasma CVD
Method and apparatus for assembling rotating machines
Mattress base assembly kit
Mould member for moulding three-dimensional products, system and methods of manufacturing a mould member
Opto-electronic sensor array and a method to operate an opto-electronic sensor array
Method for using a charge coupled device as a peak detector