Resources Contact Us Home
Semiconductor wafer including cracking stopper structure and method of forming the same

Image Number 7 for United States Patent #7977232.

A semiconductor wafer may include, but is not limited to, the following elements. A semiconductor substrate has a device region and a dicing region. A stack of inter-layer insulators may extend over the device region and the dicing region. Multi-level interconnections may be disposed in the stack of inter-layer insulators. The multi-level interconnections may extend in the device region. An electrode layer may be disposed over the stack of inter-layer insulators. The electrode layer may extend in the device region. The electrode layer may cover the multi-level interconnections. A cracking stopper groove may be disposed in the dicing region. The cracking stopper groove may be positioned outside the device region.

  Recently Added Patents
Methods and apparatuses for configuring and operating graphics processing units
Macrocyclic cysteine protease inhibitors and compositions thereof
Method and apparatus for allocating erasure coded data to disk storage
TPO compositions, articles, and methods of making the same
Synthesis of 8-amino boron dipyrromethenes having blue fluorescence
Switching device and electronic apparatus using the same
Quantifying the risks of applications for mobile devices
  Randomly Featured Patents
Mounting ring for fitting pipe sections
Arrangements and methods for per tone equalization with reduced complexity
Methods for visualizing crystals and distinguishing crystals from other matter within a biological sample
System and method for detecting file content similarity within a file system
Fixture for decapsulating plastic encapsulated electronic device packages
Lamp socket
Lyotropic liquid crystal composition
System for controlling the advance of a rotary machine tool
Inflatable swimming pool with a sun shield