Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor wafer including cracking stopper structure and method of forming the same










Image Number 7 for United States Patent #7977232.

A semiconductor wafer may include, but is not limited to, the following elements. A semiconductor substrate has a device region and a dicing region. A stack of inter-layer insulators may extend over the device region and the dicing region. Multi-level interconnections may be disposed in the stack of inter-layer insulators. The multi-level interconnections may extend in the device region. An electrode layer may be disposed over the stack of inter-layer insulators. The electrode layer may extend in the device region. The electrode layer may cover the multi-level interconnections. A cracking stopper groove may be disposed in the dicing region. The cracking stopper groove may be positioned outside the device region.








 
 
  Recently Added Patents
Display screen or portion thereof with animated graphical user interface
Fixing apparatus
Method of operating an electromechanical converter, a controller and a computer program product
Engineered nucleic acids encoding a modified erythropoietin and their expression
Sports helmet
Apparatus and method for connection control with media negotiation successful on different media formats
Label with surface ornamentation
  Randomly Featured Patents
Polyimide powder for antistatic polyimide molded product and polyimide molded product thereby
Holding oven
Viral polymerase inhibitors
Antifreeze compositions comprising carboxylic acid and cyclohexenoic acid
Antibody catalysis of enantio- and diastereo-selective aldol reactions
Determine intended motions
Steering switch module
Hollow fiber blood oxygenator
Presentation system with overhead projector
Tension rod for shower curtains, towels, window treatments, or the like