Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chipstack package and manufacturing method thereof










Image Number 6 for United States Patent #7977156.

A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages.








 
 
  Recently Added Patents
Woven mesh substrate with semiconductor elements, and method and device for manufacturing the same
Method and device for generating low-jitter clock
Toothbrush holder
Faucet
Can seam inspection
Hybrid interconnect scheme including aluminum metal line in low-k dielectric
Combining seismic data from sensors to attenuate noise
  Randomly Featured Patents
Domestic origination to international termination country set logic
Adjustable stub guard assembly for corp cutting apparatus
Pressure vessel
Method for constructing a turbine shroud
Apparatus and method for transistor element reduction in circuits comparing serial data signals
Hairbrush
Container for cotton swabs
Combination organizer and accordion file
Solenoid pilot operated air activated piston driven double seat accumulator drain valve
Detachable laser optical fiber assembly and method of adjustment