Resources Contact Us Home
Chipstack package and manufacturing method thereof

Image Number 6 for United States Patent #7977156.

A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages.

  Recently Added Patents
Photoelectric conversion module
Method of operating an electromechanical converter, a controller and a computer program product
Secure data exchange for processing requests
Multi-band dipole antenna
Traveling vehicle system and self-diagnosis method for the traveling vehicle system
Ion implantation method and ion implantation apparatus
Disk-based storage device having read channel memory that is selectively accessible to disk controller
  Randomly Featured Patents
Centrifugal pump with flow measurement
Portable stolen vehicle prevention and locater with information gathering system
Balloon and manufacture thereof
Method and apparatus for improving utility of automatic dependent surveillance
Metadata schema for interpersonal communications management systems
Process for producing bulky paper with concavo-convex pattern
Spark plug socket wrench
Merchandise display rack
Image processing apparatus
Combined cap and stereo