Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chipstack package and manufacturing method thereof










Image Number 6 for United States Patent #7977156.

A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages.








 
 
  Recently Added Patents
Display screen with graphical user interface
Synthesized interoperable communications
Fuel cell system, and electric vehicle equipped with the fuel cell system
Semiconductor device and method for fabricating the same
Social network user data advertising
Multipoint photonic doppler velocimetry using optical lens elements
Apparatus and method for categorizing services using canonical service descriptions
  Randomly Featured Patents
Billing for telecommunication calls over decentralized packet networks
Method and apparatus for converting non-standard video broadcast signals to display capable video signals
Alkylation process with efficient effluent refrigeration
Dermal bandage and dermal preparation
Therapeutic apparatus for exercising the human knee
Process for preparing protein-bound melanin and/or peptide bound melanin, and products thereof
Step height reduction between SOI and EPI for DSO and BOS integration
Sliding door for a motor vehicle
Metal oxide dispersion for dye-sensitized solar cells, photoactive electrode and dye-sensitized solar cell
Method for selectively plugging deep subterranean formations with polysulfides