Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chipstack package and manufacturing method thereof










Image Number 6 for United States Patent #7977156.

A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages.








 
 
  Recently Added Patents
Semiconductor pressure sensor
Engineered nucleic acids encoding a modified erythropoietin and their expression
Real-time RSL monitoring in a web-based application
Catalyst compositions for hydroformylation reaction and hydroformylation process using the same
Distributive data capture
Multiple input multiple output transceiver
Hybrid CMOS nanowire mesh device and PDSOI device
  Randomly Featured Patents
Pivotable handle and angle adjustable device for miter saw
Protecting against canine oral papillomavirus (copy)
Holder for a measuring spoon set or the like
Steering column holding structure
Elevator chair
Method and apparatus for printing an image
Packaging box for a camera
Self-clearing material sensing apparatus
Tube gripping system for a winder chuck
Connector clip for verifying complete connection between a connector and a pipe and connector connecting structure therefor