Resources Contact Us Home
Method for slicing workpiece by using wire saw and wire saw

Image Number 12 for United States Patent #7959491.

The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line.

  Recently Added Patents
Precision geolocation of moving or fixed transmitters using multiple observers
Method and apparatuses for solving weighted planar graphs
Polymer compositions and nonwoven compositions prepared therefrom
Sample holder and method for treating sample material
Reoccuring keying system
Image processing apparatus, image display apparatus, and image processing method
Processing color and panchromatic pixels
  Randomly Featured Patents
Device and process for electronic monitoring of an adjusting drive in a vehicle
Secondary oil system
Apparatus for adjusting focus in the macro-photographing mode of an automatic focus camera
Video game console cooling mechanism
Electrical power supply fault detecting system
Reconfigurable network on a chip
Method for measuring of flow and flowmeter
Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof
Semiautomatic weapon
Pest-controlling composition