Resources Contact Us Home
Method for slicing workpiece by using wire saw and wire saw

Image Number 12 for United States Patent #7959491.

The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line.

  Recently Added Patents
Printer driver, printer control method, and recording medium
Post-processing device and image forming system
Motor assembly
Computer program and apparatus for evaluating signal propagation delays
Methods and apparatus for low power out-of-band communications
Interactivity model for shared feedback on mobile devices
Method and a system for registering a 3D pre-acquired image coordinates system with a medical positioning system coordinate system and with a 2D image coordinate system
  Randomly Featured Patents
Biomagnetic field measuring apparatus using squid magnetometers for evaluating a rotational property of a current in a subject
Equine support boot
Modular elements, network, supporting structure, construct
Method and apparatus for controlling traffic volume measurement validity in a universal mobile telecommunications system
Automatic device for compensation of AC polyphase power line voltage variations in AC-DC converters
Self-aligning flexible gear support for auxiliary gear box
Recreational ramp for wheeled vehicles and process for manufacturing same
Focalized stent implantation
Excitation wavelength sweeping type raman spectroscopic apparatus
Single crystal scintillator materials and methods for making the same