Resources Contact Us Home
Method for slicing workpiece by using wire saw and wire saw

Image Number 12 for United States Patent #7959491.

The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line.

  Recently Added Patents
Satellite mounting poles
Switchgear operating apparatus and three-phase switchgear
Mobile interactive kiosk method
Display fixture for highlighting products
Audio conversation apparatus
Context-based adaptive binary arithmetic coding engine
Method of monitoring and configuring
  Randomly Featured Patents
Locking and memory allocation in file system cache
Automatic defrost control for refrigeration systems
Modular orthosis closure system and method
Armor plate assembly
Set of golf clubs
Universal mixer
Optical communication module
I-beam measuring device
System and method for lithography process monitoring and control
Method and apparatus for extracting optimum holter ECG reading