Resources Contact Us Home
Method for smoothing wafer surface and apparatus used therefor

Image Number 6 for United States Patent #7955982.

Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.

  Recently Added Patents
Multiplanar image displays and media formatted to provide 3D imagery without 3D glasses
Method for drug screening and characterization by calcium flux
Method of purifying crude acetone stream
Device and method for processing input data of protective relay
Adaptive block pre-fetching method and system
Method, base station and system for adjusting cell wireless configuration parameter
  Randomly Featured Patents
Vehicular internal ventilating device
Plant stem holder with water supply
Multi-grade object sorting system and method
Graph structured data processing method and system, and program therefor
Method and apparatus for separating image data from a color system in image processing
Computer access control by finger anatomy and comprehension testing
Active-passive scanning system
Hierarchical coding and decoding method
Forming a micro electro mechanical system
Coated fiber product with adhered super absorbent particles