Resources Contact Us Home
Method for smoothing wafer surface and apparatus used therefor

Image Number 6 for United States Patent #7955982.

Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.

  Recently Added Patents
Methods and compositions for improved F-18 labeling of proteins, peptides and other molecules
Representing polarized light in computer models
Tire for motorcycle
Minimizing mismatch during compensation
Early kill removal graphics processing system and method
Controller for flexible and extensible flow processing in software-defined networks
  Randomly Featured Patents
Photosensitive button structure
Bad pixel cluster detection
Packaging structure for a bundle of panels
Systems and methods for allocating bandwidth for processing of packets
High Q vertical ribbon inductor on semiconducting substrate
Traction kite with deformable leading edge
License-plate frame bumper guard
Method and apparatus for measuring a relative movement between two elements
Database management and synchronization across a peer-to-peer network
Histamine measuring apparatus and a histamine measuring method