Resources Contact Us Home
Method for smoothing wafer surface and apparatus used therefor

Image Number 6 for United States Patent #7955982.

Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.

  Recently Added Patents
Magnetic disk control device, magnetic disk apparatus, magnetic disk control method and computer program
Systems and methods for determining a file set
Circuit board and mother laminated body
Stator for electric machine
Method and apparatus for detecting and treating tachyarrhythmias incorporating diagnostic/therapeutic pacing techniques
High precision data extraction
Fitting of brightness as a function of current amplitude in a visual prosthesis
  Randomly Featured Patents
Method of manufacturing gradient index optical elements
Method for making a substantially planar structure constituted by jointed building elements
Pointing device
Hydrolysis of arabinoxylan
Method for inhibition of viral morphogenesis
Solar power supply and battery charging circuit
Display device
MAGE-10 encoding cDNA, the tumor rejection antigen precursor MAGE-10, antibodies specific to the molecule, and uses thereof
Optical pickup actuator capable of performing focusing, tracking and tilting operations
Demonstration mannequin for simulating catheter malposition