Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for smoothing wafer surface and apparatus used therefor










Image Number 6 for United States Patent #7955982.

Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.








 
 
  Recently Added Patents
Managing distributed applications using structural diagrams
Zoom lens
Programming of DIMM termination resistance values
Forming agent for gate insulating film of thin film transistor
Stroboscopic image modulation to reduce the visual blur of an object being viewed by an observer experiencing vibration
Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages
Estimating stack distances
  Randomly Featured Patents
Heat application method
Liquid crystal display having a protective alignment film and fabricating method thereof
System and method for modulation mapping
DC-AC converter protection
Tape winding direction switch device of cassette tape recorder
Adhesives with a high level of adhesion on plastics materials
Color picture tube shadow mask having a column-to-column spacing with a pseudo-cyclic variation
Gaseous sequestration methods and systems
Dielectric ceramic composition
Bushing assembly for suspension arm