Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for smoothing wafer surface and apparatus used therefor










Image Number 6 for United States Patent #7955982.

Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.








 
 
  Recently Added Patents
Semiconductor device
System and method of creating and providing SMS http tagging
Stage drive method and stage unit, exposure apparatus, and device manufacturing method
Device for preparing a body fluid for a bacteriological analysis
Identification wristband
Apparatus and method for foreground detection
Irreversible thermochromic ink compositions
  Randomly Featured Patents
Integrated circuit card having staggered sequences of connector terminals
Gas bag with limiting straps
Bi-direction constant current device
Systems and methods for performing real time seismic surveys
Grass trimming device
Cartridge receiving casing
Athermal laser glass composition
Device for evaluating drag reduction
Link actuating device
Method of operating a spark ignition internal combustion engine