Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
High aspect ratio electroplated metal feature and method










Image Number 3 for United States Patent #7951714.

Disclosed are embodiments of an improved high aspect ratio electroplated metal structure (e.g., a copper or copper alloy interconnect, such as a back end of the line (BEOL) or middle of the line (MOL) contact) in which the electroplated metal fill material is free from seams and/or voids. Also, disclosed are embodiments of a method of forming such an electroplated metal structure by lining a high aspect ratio opening (e.g., a high aspect ratio via or trench) with a metal-plating seed layer and, then, forming a protective layer over the portion of the metal-plating seed layer adjacent to the opening sidewalls so that subsequent electroplating occurs only from the bottom surface of the opening up.








 
 
  Recently Added Patents
Train car for proppant containers
Process for preparation of Efavirenz
Autobrake and decel control built-in test equipment
Wireless communication system, wireless communication device, wireless communication method, and program
Method and apparatus for map transmission in wireless communication system
Rechargeable battery
High-frequency-link power-conversion system having direct double-frequency ripple current control and method of use
  Randomly Featured Patents
Pressure operated valve systems
Mounting structure of plastic glass in watch case
Method of modeling subsurface formations
Plastic cap and container construction
Footwear with GPS
Methods of producing and sequencing modified polynucleotides
Switching DC-to-DC converter with discontinuous pulse skipping and continuous operating modes without external sense resistor
Battery with integrated tracking device
Mount for replaceable ink jet head
Method of forming a tamper resistant envelope closure