Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
High aspect ratio electroplated metal feature and method










Image Number 3 for United States Patent #7951714.

Disclosed are embodiments of an improved high aspect ratio electroplated metal structure (e.g., a copper or copper alloy interconnect, such as a back end of the line (BEOL) or middle of the line (MOL) contact) in which the electroplated metal fill material is free from seams and/or voids. Also, disclosed are embodiments of a method of forming such an electroplated metal structure by lining a high aspect ratio opening (e.g., a high aspect ratio via or trench) with a metal-plating seed layer and, then, forming a protective layer over the portion of the metal-plating seed layer adjacent to the opening sidewalls so that subsequent electroplating occurs only from the bottom surface of the opening up.








 
 
  Recently Added Patents
Navigating applications using side-mounted touchpad
Virtual links in a routed ethernet mesh network
Medicament delivery device and a method of medicament delivery
Testing apparatus and testing method for telephone apparatus
Programming method of non-volatile memory device
Adjustable high precision surveying device
Flat panel display device and stereoscopic display device
  Randomly Featured Patents
Image information reading apparatus
Two compartment tray
Structural design method and recording medium
Voltage generator
Apparatus and method for providing access to secured data or area
Methods and apparatus for shaping moving geometric shapes
Method of forming trench isolation in a semiconductor device and structure formed thereby
Progenitor cell materials and methods
Process and device for determining the soot content of combustion gases
System and method for monitoring an automated voice response system