Resources Contact Us Home
High aspect ratio electroplated metal feature and method

Image Number 3 for United States Patent #7951714.

Disclosed are embodiments of an improved high aspect ratio electroplated metal structure (e.g., a copper or copper alloy interconnect, such as a back end of the line (BEOL) or middle of the line (MOL) contact) in which the electroplated metal fill material is free from seams and/or voids. Also, disclosed are embodiments of a method of forming such an electroplated metal structure by lining a high aspect ratio opening (e.g., a high aspect ratio via or trench) with a metal-plating seed layer and, then, forming a protective layer over the portion of the metal-plating seed layer adjacent to the opening sidewalls so that subsequent electroplating occurs only from the bottom surface of the opening up.

  Recently Added Patents
Support core for cold shrink tube
Programming method of non-volatile memory device
Thwarting keyloggers using proxies
Sheet member and method of manufacturing sheet member
Detecting the type of NAT firewall using messages
Power supply system for motor vehicle
Collaborative system for capture and reuse of software application knowledge and a method of realizing same
  Randomly Featured Patents
Dishwasher panel
Speaker device
Information recording medium, and apparatus and method for recording information to information recording medium
Stimulated oil production using reactive fluids
Use of cocoa polyphenols for treating a prostate hyperplasia, a specific cocoa extract and applications
Thermal baffle for water heaters and the like
Micro-cavity measuring equipment and method based on double optical fiber coupling
Quick action clamping cylinder with a simplified structure
Safety device for ladders
Bendable, extendable hairbrush with removable brush head