Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Shock-absorbing system for an article of footwear










Image Number 7 for United States Patent #7946059.

An article of footwear including an upper overlaying an outer bottom assembly, such assembly including, in the area of the heel, at least two support blocks made of a damping/shock-absorbing material and arranged on respective ones of the lateral and medial sides of the bottom assembly. Each of the support blocks extends vertically, substantially from the upper end to the lower end of the bottom assembly, the support blocks being deformable substantially independently of one another. Further, the outer bottom assembly includes an elastically deformable element that includes an upper portion that extends transversely relative to the bottom assembly and covers the upper end of each of the support elements, as well as at least two legs which extend laterally and medially, respectively, and externally cover respective ones of the support elements, substantially over their entire heights.








 
 
  Recently Added Patents
Searchlight
Telecommunications system and method
Triazolylphenyl sulfonamides as serine/threonine kinase inhibitors
Monitoring heap in real-time by a mobile agent to assess performance of virtual machine
Information distribution system, information distributing method, node, and recording medium
Method and device for synthesizing image
Power supply system for motor vehicle
  Randomly Featured Patents
Cautery medical instrument
Push pier assembly with hardened coupling sections
Barbeque grill with basketball appearance
Narrow crossbow with large power stroke
Oligomeric triarylmethane dyes
Oxidative hair dyeing method, composition, and kit utilizing hydroxyl substituted benzothiazines
Prodrug acid esters of [2-(4-benzyl-3-hydroxy-piperidin-1-yl)-ethansulfonyl]phenol
Dual load trailer
Triblock polymers of the BAB type having hydrophobic association capabilities for rheological control in aqueous systems
Methods of implementing and enhanced silicon-on-insulator (SOI) box structures