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Double sided semiconduction device with edge contact and package therefor










Image Number 3 for United States Patent #7944035.

A semiconductor die has devices such as MOSgated devices, diodes and the like formed into the top and bottom surfaces of the die. One terminal of each of the devices terminal in the interior center of the die and a common contact is made to the interior center of the die at one edge of the die. Various packages for the die having a reduced foot print on a support substrate are disclosed.








 
 
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