Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Chemical mechanical planarization pad Image Number 3 for United States Patent #7931713. A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.       Recently Added Patents Optical disc apparatus with mechanical chassis having a recess Portable generator powered light stand Method for moving a machine element of an automation machine and a control device System and method for synchronized authoring and access of chat and graphics Memory system for mapping SCSI commands from client device to memory space of server via SSD Image forming apparatus for producing plural images on a single sheet with a user selected integration pattern Out-of-order execution microprocessor with reduced store collision load replay reduction   Randomly Featured Patents Motion detection and estimation apparatus and method thereof Vacuum power head with bare floor feature Electric motor mounting fixture Semiconductor wafer and method for fabrication thereof Shale stabilizing drilling fluid Recombinant promoter for gene expression in monocotyledonous plants Wearable article having a temperature change element Automated assembly device for assembly of components of a disc drive Fuel efficient valve mechanism for internal combustion engines Book organizing device © 2006-2008 PatentGenius. All Rights Reserved.