Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 3 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Optical coherence tomography with multiple sample arms
Data processing system, data processing method, and image forming apparatus
Method of analyzing cell structures and their components
PCSK9 antagonists
Pickup device and method for manufacturing the same
Multiple RF band operation in mobile devices
Distortion estimation for quantized data
  Randomly Featured Patents
Pulse oximeter probe-off detector
Multi-user video switchable translator
Low pollution combustor
High speed voltage regulator with integrated loseless current sensing
Clip for forming a concertina configuration of helical barbed tape
Water slide
Method for producing webs, panels or sandwich elements of foam plastics reinforced with rovings
System logging within operating system partitions using log device nodes that are access points to a log driver
Telephone apparatus
Low noise level differential amplifier