Resources Contact Us Home
Chemical mechanical planarization pad

Image Number 3 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.

  Recently Added Patents
Dual functional medium shredding machine structure
Computer system and volume migration control method using the same
Devices, systems, and methods for tactile feedback and input
PLL circuit
Light receiving element with offset absorbing layer
Image forming apparatus and control method therefor
Method and system for detecting data modification within computing device
  Randomly Featured Patents
Thin film write head with interlaced coil winding and method of fabrication
Representative value selector and an embodying method therefor
Auriferous gravel interceptor
Process for the preparation of stabilized styrene copolymers containing elastomer particles
Musical instrument stand
Device for fastening cutting dies on a base plate
Electric motor having composite encapsulated stator and rotor
Use of aerodynamic forces to assist in the control and positioning of aircraft control surfaces and variable geometry systems
Pre-application of grease to heat sinks with a protective coating
Bioerodible polyorthoesters from dioxolane-based diketene acetals