Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 3 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Method for the synthesis of an array of metal nanowire capable of supporting localized plasmon resonances and photonic device comprising said array
Polarity switching member of dot inversion system
Sabatier process and apparatus for controlling exothermic reaction
Stopper, motor, and disk drive apparatus
Information processing apparatus, method for controlling information processing apparatus, and storage medium
Compound semiconductor epitaxial structure and method for fabricating the same
Pull through coronary sinus pacing lead
  Randomly Featured Patents
Internal combustion engine system with an air-fuel mixture shut off means
Multi-user remote health monitoring system
Uninterruptive switching regulator
Gaskets for fluid conduits
Golf swing diagnosing device
Policy-managed DNS server for to control network traffic
Flexible switching devices
Shape selective catalyst from zeolite alpha and use thereof
Thermoplastic resin composition
Fastening arrangement in a telephone instrument of the one-piece type