Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Coated article and method for making the same
Piano keyboard with key touch point detection
Method of preparing enteric hard capsule and enteric hard capsule prepared thereby
Substituted phenylsulfur trifluoride and other like fluorinating agents
Volume compensation within a photovoltaic device
Preparation and use of meristematic cells belonging to the Dendrobium phalaenopsis, Ansellia, Polyrrhiza, Vanilla, Cattleya and Vanda genera with high content of phenylpropanoids, hydrosoluble
Hydrolases, nucleic acids encoding them and methods for making and using them
  Randomly Featured Patents
Control apparatus for automatic embroidery sewing machine
Multi-beam antenna communication system and method
Hinge assembly and portable electronic device using the same
Method and computer program for static timing analysis with delay de-rating and clock conservatism reduction
Crust remover
Cleaning apparatus for rollers used in feeding systems
Rotary drill bits with nozzle former and method of manufacturing
Power semiconductor circuit
Method for obtaining signals in electronic devices by means of interpolation between interpolation point values
Alignment mark for electron beam lithography