Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
System and method for managing content on a network interface
Display device and projector
5-HT.sub.3 receptor modulators, methods of making, and use thereof
Method and system for reduction of quantization-induced block-discontinuities and general purpose audio codec
Potentiometric-sensor chip, potentiometric assay, and assay kit
Decision management system and method
Method and apparatus for detecting an intermittent path to a storage system
  Randomly Featured Patents
Apparatus for helping a person to get in or out of a bath
Anti-MUC-1 single chain antibodies for tumor targeting
Auxiliary container for salad spinner
Sofa
System and method for processing enhanced data exchanged with an enhanced mobile station via a wireless connection
Apparatus for grinding cutting tools
Frame for holding dental prosthesis press
Dynamics compressor for an analog signal to be compressed
Purification system
Topical application product containing a lipase, a vitamin precursor and a fatty alcohol