Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Image-capturing device and projection automatic calibration method of projection device
Query optimization with awareness of limited resource usage
Discharge lamp lighting circuit
Detachably integrated battery charger for mobile cell phones and like devices
Fuel cell and a method of manufacturing a fuel cell
Programming method of non-volatile memory device
Systems and methods for automobile accident claims initiation
  Randomly Featured Patents
Cinnamide and hydrocinnamide derivatives with kinase inhibitory activity
Call waiting feature for a telephone line connected to the internet
Semiconductor device and method of manufacturing the same
Method for cutting sheet metal
Memory device and method for testing memory devices with repairable redundancy
Signal receiving apparatus
Collapsible chair
Low retention force release and arming mechanism for ordinance devices
Edge normal process
Arrays, system and method for bi-directional data transmission