Resources Contact Us Home
Chemical mechanical planarization pad

Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.

  Recently Added Patents
Magnetic element with top shield coupled side shield lamination
Group control method for machine type communication and mobile communication system using the method
Fabrication method of semiconductor device and fabrication method of dynamic threshold transistor
Process for the preparation of ethylene homopolymers or copolymers in a high-pressure reactor controlled by a model based predictive controller
Sabatier process and apparatus for controlling exothermic reaction
Methods for testing OData services
Ventilated vacuum commutation structure
  Randomly Featured Patents
Seat and back rest for a chair
Crystalline antifungal polymorph
Back-illuminated switch panel
Method and apparatus of managing cabling in an optional drive filler
Method of forming bit lines and bit line contacts in a memory device
Partitioned and foldable paper food container
Belt guide anchor and seat belt unit including the same
Solar energy concentrator system
Brushless d.c. motor having rotor position-dependent control means
Printing plate making apparatus and printing plate making method