Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Systems, methods, and media for identifying matching audio
CMOS image sensor with selectable hard-wired binning
Method of controlling a robotic tool
GNSS signal processing methods and apparatus with scaling of quality measure
Battery module
Image processing apparatus and method for defining distortion function for synthesized image of intermediate view
Stator for electric machine
  Randomly Featured Patents
Keyboard frame with induction light source
Process for the production of carbonyl-containing compounds from epoxides
Rubisco Activase with increased thermostability and methods of use thereof
Hydraulic control system for automatic transmission
Bias charging overcoat
Two-chamber underwater drainage apparatus with oneway outflow valve and dual hangar retainers
Selective WSix deposition
Asphalt release agent
Drum type washing machine
Polymer blends