Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Crosslinked core/shell polymer particles
3,7-diamino-10H-phenothiazine salts and their use
Lighting device with device for regulating the illumination according to the luminance of the illumination field and corresponding use
User interfaces
Subpixel-based image down-sampling
Notebook computer
Magnetic resonance imaging apparatus for use with radiotherapy
  Randomly Featured Patents
Drill string diverter apparatus and method
Quantitative evaluation of a color filter
Cooking rack with pivoting supports and slide stops
Corrosion-inhibited antifreeze formulations having monocarboxylic, triazole, and imidazole compounds
Assembly for mounting various work tools to a construction vehicle
Spatula
Snap-on, screw-off cap and container neck
Electrical integrated modular power node
System and method for blocking the use of a service in a telecommunication system
Binding affinity of antigenic peptides for MHC molecules