Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Antenna tuning on an impedance trajectory
Electric power steering apparatus
System and method for outputting virtual textures in electronic devices
Apparatus and method for extracting cascading style sheet rules
Video reproducing apparatus and video reproducing method
Pixel structure of organic light emitting device
Organic light emitting display device and method of manufacturing the same
  Randomly Featured Patents
Pre-mixed thermoplastic units and method of using same
Computer display control system and method
Combination of a press brake clamping system and at least a press brake tool
Orthopaedic plate and screw assembly
Assay for the identification of IgE antibody suppressors
System and method for managing CPCI buses in a multi-processing system
Methods and apparatus to control power in a printer
Locking device with key-operated lock
Optical lens vibration control for optical information recording and/or reproducing apparatus
Formatting a data storage medium to a desired block format