Resources Contact Us Home
Chemical mechanical planarization pad

Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.

  Recently Added Patents
Mobile phone
Use of LPA for encouraging pregnancy, and fertility agent
Fuel cell stack including ejector and blower for anode recirculation and method for controlling the same
Method for treating hyperglycemia
Kit and method for the capture of tumor cells
Emulsions containing arylboronic acids and medical articles made therefrom
Refuelable battery-powered electric vehicle
  Randomly Featured Patents
Removable storage medium and computer system using the same
Method and arrangement for determining movement
1-(Arylamino)-and 1-(arylimino)-pyrroles
Method for the univocal marking of materials, and ink for carrying out the same
Data addition to optical storage cards using ink dots
Synchronization system and synchronization method of multisystem control apparatus
Check-reading machine
Dual recreational vehicle sewer hook-up adapter
Plug and play device and access control method therefor
Structure for joining members