Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chemical mechanical planarization pad










Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.








 
 
  Recently Added Patents
Method of processing data and display apparatus for performing the method
Portion of a display panel with an ambiguous facial expression icon
Wireless control kit for camera
(4945
FET device having ultra-low on-resistance and low gate charge
Vehicle battery with cell balancing current paths and method of charging the same
Soybean cultivar CL1013665
  Randomly Featured Patents
Method and apparatus for guaranteeing minimum variable schedule distance by using post-ready latency
Lock
Wheelchair lift with adjustable posts
Applicator for wallboard tape
Superlattice avalanche photodiode with mesa structure
Method for NPA split processing
Lock slider for slide fasteners
Dynamic delayed transaction discard counter in a bus bridge of a computer system
Two dimensional half-tone dot discrimination device
Computerized bill consolidation, billing and payment authorization with remote access to the billing information