Resources Contact Us Home
Chemical mechanical planarization pad

Image Number 2 for United States Patent #7931713.

A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorption and electrical characteristics of the CMP pad remain substantially constant during CMP applications.

  Recently Added Patents
Far field telemetry operations between an external device and an implantable medical device during recharge of the implantable medical device via a proximity coupling
Preserving and handling native data in hybrid object trees
Sparse network almanac
Aperture stop
Process to extract quassinoids
Method and system for network configuration for virtual machines
Method and apparatus for transmitting and receiving extension information of component carrier in wireless communication system
  Randomly Featured Patents
Multiple speaker control switch for a vehicular radio receiver and cassette player
Electrostatographic reproduction apparatus with annotation function
Wire saw and slicing method using the same
Feed forward spread spectrum signal processor
Method of dynamically allocating a memory
Method of manufacturing a semiconductor device having a ground plane
Automatic transaction system
System for measuring characteristics of an object's motion
Odorant compositions containing 4,4,6-trimethyl-2-cyclohexenone
Compact arrangement for multipole, surge-proof surge arresters and encapsulated surge arrester for the same