Resources Contact Us Home
Flip-chip mounting method and bump formation method

Image Number 4 for United States Patent #7927997.

To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.

  Recently Added Patents
Electronic device assemblies
Debris tray
Treatment of influenza
Haloalky -substituted amides as insecticides and acaricides
Printing device, printing system, program, and printing method for printing based on print data from a user authorized to issue a print instruction for the print data
Imaging lens with three lens elements, and electronic apparatus having the same
  Randomly Featured Patents
Feed pump
Length-adjustable electrical sleeve heater
Diesel fuel containing wax oxidates to reduce particulate emissions
Thermal energy scavenger (stress limiter)
Hydraulic tensioner
Estimating color of a colorant deposited on a substrate
Electrical cable with strength member
Driver of a magnetic-field sending antenna with RLC circuit
Dynamically configurable electronic survey response alert system
Monogroove liquid heat exchanger