Resources Contact Us Home
Flip-chip mounting method and bump formation method

Image Number 4 for United States Patent #7927997.

To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.

  Recently Added Patents
Power converter with a variable reference voltage and inrush current limiting
Multi-dimensional credibility scoring
Tunnel magnetoresistance read head with narrow shield-to-shield spacing
Systems and methods for detailed error reporting in data storage systems
Method and apparatus for coordinating hopping of resources in wireless communication systems
Management of computer-file sharing between at least two devices
Method for configuring analog-to-digital converter keys and non-transitory machine readable medium storing program code executed for performing such method
  Randomly Featured Patents
Power actuated roof vent apparatus and method of use
Combination weighing machine
Process for sewing and folding a flexible work piece
Bottle caddy
Active matrix display device
Dispiropyrrolidine derivatives
Method and apparatus for converting barrel type units into free standing merchandising displays for holding chilled products and the like
Promoter and construct for plant transformation
ADPCM decoder with an integral digital receive gain and method therefor
Closure for valises or the like which is provided with a permutation lock