Resources Contact Us Home
Spinel wafers and methods of preparation

Image Number 8 for United States Patent #7919815.

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise .alpha.-Al.sub.2O.sub.3 and an organic phosphate.

  Recently Added Patents
Oscillator circuit which compensates for external voltage supply, temperature and process
Microcapsules, their use and processes for their manufacture
Methods and apparatus for mitigating interference between co-located collaborating radios
Animation control apparatus, animation control method, and non-transitory computer readable recording medium
System and method for providing an extended platform for an operating system
Methods for testing OData services
Architecture for accelerated computer processing
  Randomly Featured Patents
Method and solution for the room temperature dyeing of nylon
Security door bar system
Floor puller to straighten a bent member
Flexible module chain conveyor
Pay telephone with sanitized tissue dispenser
Pivoting shoulder strap for a backpack
Fully differential output CMOS power amplifier
Power supply regulator for an automatic exposure adjusting circuit for use in a camera
Control rod position detector
Split power tool with extension