Resources Contact Us Home
Spinel wafers and methods of preparation

Image Number 7 for United States Patent #7919815.

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise .alpha.-Al.sub.2O.sub.3 and an organic phosphate.

  Recently Added Patents
Verification of a portable consumer device in an offline environment
Semiconductor device and manufacturing method thereof
Method for manufacturing light emitting diodes
Electronic time stamping apparatus for use with an inground transmitter
Therapeutic vitamin D sun-protecting formulations and methods for their use
HYR1 as a target for active and passive immunization against Candida
Device and method for superimposing patterns on images in real time, particularly for guidance by location
  Randomly Featured Patents
Process for producing hydrogen cyanide
Fiber management module with cable storage
Value chain management
Multi-phase PSK modulation apparatus
Submersible pump puller and method of use
Phosphorus-containing reaction mixture
Phenyl-substituted 1,3,5-triazine compound, process for producing the same, and organic electroluminescent device containing the same as component
Information processing apparatus, information processing method and computer-readable recording medium
Conductive coating arrangement
Lipid matrix-assisted chemical ligation and synthesis of membrane polypeptides