Resources Contact Us Home
Spinel wafers and methods of preparation

Image Number 7 for United States Patent #7919815.

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise .alpha.-Al.sub.2O.sub.3 and an organic phosphate.

  Recently Added Patents
Method for the synthesis of an array of metal nanowire capable of supporting localized plasmon resonances and photonic device comprising said array
Multi-protocol data transfers
Owner-brokered knowledge sharing machine
Method for producing a flexible composite elastomeric polyurethane skin
Antenna arrangement and antenna housing
Sensor interface engineering
Vehicle tail lamp
  Randomly Featured Patents
Inking device
Separator for fuel cell and fuel cell
Static dissipating heat curable silicone rubber compositions
Method and device for controlling the drive unit of a vehicle
Method and system for a data transmission in a communication system
Millimeter-wave (MMW) synthesizer with FSK modulation transmitter
Spacer rings to compensate for disk warpage
Resource reservation for massively parallel processing systems
Pressure oil energy recover/regenation apparatus