Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Spinel wafers and methods of preparation










Image Number 5 for United States Patent #7919815.

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise .alpha.-Al.sub.2O.sub.3 and an organic phosphate.








 
 
  Recently Added Patents
Methods and apparatus for deactivating internal constraint curves when inflating an N-sided patch
Plant disease control composition and its use
Method and system for phase-sensitive magnetic resonance imaging
Tint block image generation program and tint block image generation device
Horizontal cable manager
Method and system for accomplishing user equipment purge
Reproducible dither-noise injection
  Randomly Featured Patents
Insect repellant compounds
Color misconvergence measurement using a common monochrome image
Method of loading and discharging a drip chamber
Method and system relating to social media technologies
Method for manufacturing hybrid electronic circuits for active implantable medical devices
Low-rate speech coder for non-speech data transmission
Digital video camera with automatic white balance and a method thereof
Tooth inclination assessment
System for installing suspended ceiling
Fingernail polish bottle