Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Spinel wafers and methods of preparation










Image Number 5 for United States Patent #7919815.

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise .alpha.-Al.sub.2O.sub.3 and an organic phosphate.








 
 
  Recently Added Patents
Providing user interfaces and window previews for hosted applications
Position and orientation measurement apparatus, position and orientation measurement method, and storage medium
Compound semiconductor device and manufacturing method therefor
System and method for supporting fibre channel over ethernet communication
System, method and apparatus for pausing multi-channel broadcasts
Pharmaceutical treatment process using chitosan or derivative thereof
Plasma doping method and plasma doping apparatus
  Randomly Featured Patents
Method for the determination of urinary protein and creatinine
Elliptical tire mold
Sign system adaptor
Communication system and device
Customer service routing system and method
High-force spring probe with improved axial alignment
Computer-implemented method and system for managing accounting and billing of transactions over public media such as the internet
Boomerang
Glass manufacturing container, glass manufacturing apparatus with the same and glass manufacturing method using glass manufacturing apparatus
Protective shield for vertical tracks