Resources Contact Us Home
Spinel wafers and methods of preparation

Image Number 10 for United States Patent #7919815.

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise .alpha.-Al.sub.2O.sub.3 and an organic phosphate.

  Recently Added Patents
Pyridazine compounds for controlling invertebrate pests
Visibility radio cap and network
Device for installing conducting components in structures
Memory system with data line switching scheme
Preferential selection of candidates for delta compression
Support tray for server
Advertising system and method
  Randomly Featured Patents
Gasifying black liquor with recycling of generated hydrogen sulphide gas to the gasifier
Photoelectric digital position measuring system
Tool holder having a clamp plate for transmitting clamping forces from a clamping arm to a cutting insert
Pulse generating apparatus
Metal semiconductor optical device
System and method for managing different transmission architectures in a passive optical network
Gyrasphere crusher with bladder operated bowl lock mechanism
Stepping motor
Method and an arrangement for initiating radiation absorption measurements of gaseous media
Process for synthesizing tackifier resin