Resources Contact Us Home
Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Image Number 10 for United States Patent #7902638.

A semiconductor wafer contains a plurality of die with contact pads disposed on a first surface of each die. Metal vias are formed in trenches in the saw street guides and are surrounded by organic material. Traces connect the contact pads and metal vias. The metal vias can be half-circle vias or full-circle vias. Metal vias are also formed through the contact pads on the active area of the die. Redistribution layers (RDL) are formed on a second surface of the die opposite the first surface. Repassivation layers are formed between the RDL for electrical isolation. The die are stackable and can be placed in a semiconductor package with other die. The vias through the saw streets and vias through the active area of the die, as well as the RDL, provide electrical interconnect to the adjacent die.

  Recently Added Patents
Software self-checking systems and methods
Support core for cold shrink tube
Sensor coating
System and method for internet based procurement of goods and services
Light fixture
Method of manufacturing toner
  Randomly Featured Patents
Shelving support bracket
Concentrating solar energy receiver
Soluble and curable fluorine-containing copolymer suitable as paint vehicle
Method for treating scale
Method and apparatus for prefilling and hydroforming parts
Balloon fill gauge
Positive lock coupling
Optical connector adapter
Boiling water reactor core and fuel assemblies therefor