Resources Contact Us Home
Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Image Number 10 for United States Patent #7902638.

A semiconductor wafer contains a plurality of die with contact pads disposed on a first surface of each die. Metal vias are formed in trenches in the saw street guides and are surrounded by organic material. Traces connect the contact pads and metal vias. The metal vias can be half-circle vias or full-circle vias. Metal vias are also formed through the contact pads on the active area of the die. Redistribution layers (RDL) are formed on a second surface of the die opposite the first surface. Repassivation layers are formed between the RDL for electrical isolation. The die are stackable and can be placed in a semiconductor package with other die. The vias through the saw streets and vias through the active area of the die, as well as the RDL, provide electrical interconnect to the adjacent die.

  Recently Added Patents
Inverter device for washing machine
Method and apparatus for supporting location services with a streamlined location service layer
System and method for managing switch and information handling system SAS protocol communication
Hierarchal structuring of nodes in a peer-to-peer network
Method and system for providing a computer implemented control system for an automated system
Non-bussed vehicle amplifier diagnostics
Emergency communications system
  Randomly Featured Patents
Drive assembly for a motor vehicle
Paint roller construction having two degrees of freedom
Take-out mechanism for blow molding machine
Lighting appliance, particularly for environments without natural light
Surface-roughened rolled plate-shaped body containing converging pigment
Stretched fasteners
Information element component of a signaling message, and a method for connection control using same
N-t-butyloxycarbonyl-3-cyclohexyl-L-alanine methyl ester in crystalline form
Process for the preparation of enantiomerically pure cycloalkano-indol -and azaindol -and pyrimido [1,2a] indolcarboxcyclic acids and their activated derivatives
Electrolyte series flow in electrolytic chlor-alkali cells