Resources Contact Us Home
Chip stacked structure and the forming method

Image Number 8 for United States Patent #7888172.

A chip package structure is provided, includes a chip that having a plurality of pads and an adhesive layer on the back side; an encapsulated structure is covered around the four sides of the chip to expose the pads, and the through holes is formed within the encapsulated structure; a patterned first protective layer is formed on the portion surface of encapsulated structure, the portion of active surface of the chips, and the pads of the chip and the through holes are to be exposed; a metal layer is formed on the portion surface of the patterned first protective layer and formed to electrically connect the pads and to fill with the through holes; the patterned second protective layer is formed on the patterned first protective layer and the portion of metal layer, and the portion surface of metal layer is to be exposed; a patterned UBM layer is formed on the exposed surface of the metal layer and the portion surface of the patterned second protective layer; and the conductive elements is formed on the patterned UBM layer and electrically connect to the metal layer.

  Recently Added Patents
Compact semiconductor memory device having reduced number of contacts, methods of operating and methods of making
Touch screen panel
Thermochromic microparticles, dispersions thereof, and manufacturing method thereof, as well as light-modulating coatings, light-modulating films and light-modulating inks
Method and system for dynamic digital rights bundling
Battery pack with interchangeable circuit substrates
Unsupervised document clustering using latent semantic density analysis
Luminescent nanosheets, and fluorescent illuminators, solar cells and color displays utilizing the same as well as nanosheet paints
  Randomly Featured Patents
Self centering bore measurement unit
Fleet data monitoring system
Fan blade
Lagerstroemia plant named `PIILAG-II`
Method of making a bipolar transistor with high-low emitter impurity concentration
Method and apparatus for controlling the heat balance in aluminum reduction cells
Paradigm in multimedia services creation methodology, and new service creation and service execution environments
Paper towel roll holder with adjustable pressure member
Radio frequency data communications device
Methods for fabricating large single-grained ferroelectric thin film, for fabricating ferroelectric thin film capacitor using the same, and for fabricating ferroelectric memory device using th