Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of forming laterally distributed LEDs










Image Number 3 for United States Patent #7888152.

A method of forming laterally distributed light emitting diodes (LEDs) is disclosed. A first buffer layer with a first type of conductivity is formed on a semiconductor substrate, and a dielectric layer is formed on the first buffer layer. The dielectric layer is patterned to form a first patterned space therein, followed by forming a first active layer in the first patterned space. The dielectric layer is then patterned to form a second patterned space therein, followed by forming a second active layer in the second patterned space. Second buffer layers with a second type of conductivity are then formed on the first active layer and the second active layer. Finally, electrodes are formed on the second buffer layers and on the first buffer layer.








 
 
  Recently Added Patents
Methods and systems for assessing sales activity of a merchant
Bamboo scrimber and manufacturing method thereof
Non-disruptive configuration of a virtualization controller in a data storage system
Managing multiple web services on a single device
Test method for inspection device, particularly for label seating inspection device
Drugs for prophylaxis or mitigation of taxane-induced neurotoxicity
Aqueous composition with agents to inhibit water evaporation
  Randomly Featured Patents
Fused polycyclic compounds and organic light-emitting device using the same
Radiation therapy and scanning system
Network cable testing device
Tri-state detection circuit for use in devices associated with an imaging system
Removing color aliasing artifacts from color digital images
Apparatus for modulating the flow of air and fuel to a gas burner
Method and apparatus for deriving a combined transmit power control command during handover
Resin laminate and method of making
Method of manufacturing semiconductor device having capacitor under bit line structure
Apparatus for manufacturing operations using non-contact position sensing