Resources Contact Us Home
Light emitting diode structure, LED packaging structure using the same and method of forming the same

Image Number 13 for United States Patent #7883910.

A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.

  Recently Added Patents
Distylium plant named `PIIDIST-I`
Wireless communication system using pilot allocation, method and pilot pattern thereof
Bioactive agent-loaded heart-targeting nanoparticles
Phase locking loop
System and method for parallel video processing in multicore devices
Measuring device and measuring method that use pulsed electromagnetic wave
Method and devices for handling access privileges
  Randomly Featured Patents
Method and apparatus for analyzing heart rate variability
Energy storage and hold-up method and apparatus for high density power conversion
Modified pigment-based inks and method of making modified pigment-based inks
Support for baby
EIP pack for separating oil from water
Modular communications socket
Photoconductive member mounting mechanism for an electrophotographic reproduction apparatus
Device including a temperature sensor
Controlling appratus and controlling method for signal outputing circuit and video system
Catalytic reactor