Resources Contact Us Home
Light emitting diode structure, LED packaging structure using the same and method of forming the same

Image Number 13 for United States Patent #7883910.

A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.

  Recently Added Patents
Vehicle control apparatus
Method of sheet alignment and method of post-processing comprising the same and method of image formation
Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package
Electronic device package and fabrication method thereof
1,3-diiodohydantoin compound and production method thereof
Visual model importation
  Randomly Featured Patents
Method and apparatus for sequentially numbering mail pieces
High efficiency cyclone separator
System for marketing leisure activity services through prepaid tickets
Method of monitoring CO concentrations in hydrogen feed to a PEM fuel cell
Tire cure bladder composition with alkylphenoxypoly (alkyleneoxy) alkanol
Holder for chemiluminescent signal
Socket connector having structure for preventing sideways movement
Pad clip for disc brake
Portable telephone set with crime prevention function
Door for an automobile