Resources Contact Us Home
Semiconductor device and method for manufacturing the same

Image Number 13 for United States Patent #7880301.

A semiconductor device includes a semiconductor element including a semiconductor substrate having an element region, a laminated film formed on the semiconductor substrate and including a low dielectric constant insulating film, and a laser-machined groove provided to cut at least the low dielectric constant insulating film. The semiconductor element is connected to a wiring substrate via a bump electrode. An underfill material is filled between the semiconductor element and the wiring substrate. The fillet length Y (mm) of the underfill material satisfies a condition of Y>-0.233X+3.5 (where X>0, and Y>0) with respect to the width X (.mu.m) of the laser-machined groove.

  Recently Added Patents
Support core for cold shrink tube
Image processing apparatus, remote management system, license update method, and computer program product
Non-volatile semiconductor memory and data processing method in non-volatile semiconductor memory
Methods and systems for determining the reliability of transaction
Electric rotating machine for vehicle
Compact light shield for flash photography
Motor device and method of manufacturing the same
  Randomly Featured Patents
Multilayer breathable film
Formulation for inhalation
Method and apparatus for graphical representation of elements in a network
Spray cooled hood system for handling hot gases from a metallurgical vessel utilizing pneumatic processing of molten metal
Variable wall thickness for delivery sheath housing
Power supply having temperature sensors for detecting battery temperatures
Miniature motor
Lightweight metal container
Medication delivery pen