Resources Contact Us Home
Semiconductor device and method for manufacturing the same

Image Number 13 for United States Patent #7880301.

A semiconductor device includes a semiconductor element including a semiconductor substrate having an element region, a laminated film formed on the semiconductor substrate and including a low dielectric constant insulating film, and a laser-machined groove provided to cut at least the low dielectric constant insulating film. The semiconductor element is connected to a wiring substrate via a bump electrode. An underfill material is filled between the semiconductor element and the wiring substrate. The fillet length Y (mm) of the underfill material satisfies a condition of Y>-0.233X+3.5 (where X>0, and Y>0) with respect to the width X (.mu.m) of the laser-machined groove.

  Recently Added Patents
Computer program and apparatus for evaluating signal propagation delays
Coding circuitry for difference-based data transformation
Stability control system with body-force-disturbance heading correction
System and method for transferring data in storage controllers
Single integrated circuit configured to operate both a capacitive proximity sensor device and a resistive pointing stick
Vacuum cleaner filter adapter ring
  Randomly Featured Patents
Method and apparatus for separate mark and wait instructions for processors having multiple memory ports
Multi-walled tamper-proof container and method for enhancing tamper evidence
Catheter anchoring system
Method for manufacturing high-strength formed coke in slight mutual agglomeration using horizontal type coke oven battery
Digital radiotelephone apparatus
Buckle with reinforcing ridge and groove
Gravity-type steam accumulator
Stacker device
Tampon outer surface having increasing number of written identifiers to indicate absorbency
Battery-powered mining vehicle