Resources Contact Us Home
Semiconductor device and method for manufacturing the same

Image Number 13 for United States Patent #7880301.

A semiconductor device includes a semiconductor element including a semiconductor substrate having an element region, a laminated film formed on the semiconductor substrate and including a low dielectric constant insulating film, and a laser-machined groove provided to cut at least the low dielectric constant insulating film. The semiconductor element is connected to a wiring substrate via a bump electrode. An underfill material is filled between the semiconductor element and the wiring substrate. The fillet length Y (mm) of the underfill material satisfies a condition of Y>-0.233X+3.5 (where X>0, and Y>0) with respect to the width X (.mu.m) of the laser-machined groove.

  Recently Added Patents
Semiconductor chip, stack module, and memory card
Phosphor adhesive sheet, light emitting diode element including phosphor layer, light emitting diode device, and producing methods thereof
Promoting content
Placental tissue grafts
Apparatus for touch screen avionic device
Stability control system with body-force-disturbance heading correction
Active tags
  Randomly Featured Patents
Process for the removal of aromatic
Paper coating system and method
Phosphorylated nonapeptides, processes for the preparation thereof and pharmaceutical compositions containing them
Directly compressible acetaminophen granulation
Suture needle holder for endoscopic use
Trans-dihalogenostilbene compounds and liquid crystal electro-optical devices using them
Support for electrical resistances of ovens or kilns with ceramic mantle thermal insulation
Food container
Method and apparatus for measuring the working condition of the brain with periodic stimuli
Maintenance of flavor intensity in pressed tablets