Resources Contact Us Home
Semiconductor device and method for manufacturing the same

Image Number 13 for United States Patent #7880301.

A semiconductor device includes a semiconductor element including a semiconductor substrate having an element region, a laminated film formed on the semiconductor substrate and including a low dielectric constant insulating film, and a laser-machined groove provided to cut at least the low dielectric constant insulating film. The semiconductor element is connected to a wiring substrate via a bump electrode. An underfill material is filled between the semiconductor element and the wiring substrate. The fillet length Y (mm) of the underfill material satisfies a condition of Y>-0.233X+3.5 (where X>0, and Y>0) with respect to the width X (.mu.m) of the laser-machined groove.

  Recently Added Patents
Adjustable box extender
Polyurethane resin, toner for developing electrostatic charge image, electrostatic charge image developer, toner cartridge, process cartridge, image forming apparatus, and image forming method
Scanning of a touch screen
Query optimization with awareness of limited resource usage
State detection device, electronic apparatus, measurement system and program
Methods and systems for providing a business repository
Methods for measuring media performance associated with adjacent track interference
  Randomly Featured Patents
Detergent tablets-package combination
Photomask and pattern transfer method for transferring a pattern onto a substrate having different levels
Roller skate
Manufacturing reference database
Apparatus for examining a body by radiation such as X or gamma radiation
Process for the production of diaryl carbonates
Coaxially lockable poly-axial bone fastener assemblies
Method and apparatus for assembling tire and wheel and filling inner pressure
Cooling system for surfaces of high speed operating flight craft
Preparation of acetic acid