Resources Contact Us Home
Semiconductor device for preventing voids in the contact region and method of forming the same

Image Number 3 for United States Patent #7875982.

A semiconductor device includes: an interlayer insulation film; a lower interconnection layer; an upper interconnection layer; and a via hole extending through the interlayer insulation film to establish electric connection between the lower and upper interconnections; wherein a plurality of interconnection lines is provided in the lower interconnection layer, and a contact region is formed for contact with the via hole by partially joining at least two interconnection lines, and a void exists in a first region of the interlayer insulation film located between adjacent interconnection lines, and no void exists in a second region of the interlayer insulation film located between a contacting portion of the via hole in the contact region and an interconnection line adjacent to the contact region, whereby reliably preventing any contact between a via hole and a void formed in an interlayer insulation film even when the via hole is greatly displaced.

  Recently Added Patents
System and method for the heterologous expression of polyketide synthase gene clusters
Liquid crystal display and manufacturing method thereof
MIM capacitor and associated production method
Pandemic protocol for emergency dispatch
Bitter taste receptors
Mass spectrometry device and method using ion-molecule reaction ionization
Medical injector
  Randomly Featured Patents
Portable toilet seat cover
Player key for an instant-win lottery ticket and method for validating same
Means for securing a tree to ground stakes
Tension leg platform and method of instalation therefor
Photographic printer
Reduction of copper dewetting by transition metal deposition
Multi-terrain riding board
Sitting apparatus
Lockring, trim ring and molded plastic wheel cover assembly
Semiconductor memory device having a word line enable sensing circuit