Resources Contact Us Home
Semiconductor device for preventing voids in the contact region and method of forming the same

Image Number 3 for United States Patent #7875982.

A semiconductor device includes: an interlayer insulation film; a lower interconnection layer; an upper interconnection layer; and a via hole extending through the interlayer insulation film to establish electric connection between the lower and upper interconnections; wherein a plurality of interconnection lines is provided in the lower interconnection layer, and a contact region is formed for contact with the via hole by partially joining at least two interconnection lines, and a void exists in a first region of the interlayer insulation film located between adjacent interconnection lines, and no void exists in a second region of the interlayer insulation film located between a contacting portion of the via hole in the contact region and an interconnection line adjacent to the contact region, whereby reliably preventing any contact between a via hole and a void formed in an interlayer insulation film even when the via hole is greatly displaced.

  Recently Added Patents
Aluminum oxide coated cutting tool and method of manufacturing thereof
System and method for enhancing buyer and seller interaction during a group-buying sale
Controlling generation of debug exceptions
Optical imaging device and imaging method for microscopy
Methods and devices for multiple-mode radio frequency synthesizers
Puncture resistant fabric
Wireless monitoring in process applications
  Randomly Featured Patents
Pantihose packaging and manufacture
Image forming apparatus
System and method for on-hold call back
Multiple-sample segmented sampling device and method of use
Hydro-mechanical transmission system for an agricultural combine
Compact and light multi-exercise device providing hyperextension and instability in all directions
Apparatus for cutting veneer pieces into equal sections
Method and apparatus for measuring gases in a metal sample
Leak detection apparatus for blister packs
Golf club shaft and method for manufacturing same