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Transferring device and transferring method

Image Number 5 for United States Patent #7875144.

A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit 11 provided with a supporting face for a semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes a stacked body of adhesive sheets S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S positioned in an outermost layer and the semiconductor wafer W.

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