Resources Contact Us Home
Transferring device and transferring method

Image Number 5 for United States Patent #7875144.

A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit 11 provided with a supporting face for a semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes a stacked body of adhesive sheets S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S positioned in an outermost layer and the semiconductor wafer W.

  Recently Added Patents
Method and apparatus for detecting an intermittent path to a storage system
Auto-provisioning of network services over an Ethernet access link
Fast carrier allocation in multi-carrier systems
Test framework of visual components in a multitenant database environment
Tailoring the band gap of solar cells made of liquid silane by adding germanium
Locking flange
Adaptive period network session reservation
  Randomly Featured Patents
Water level control system
Circuitry for powering on and maintaining activation of a powered off electronic component
Active parasite power circuit
Warming stand
Device and method for photoactivation
Produce island overhang electronic shelf label holder
Radio frequency module
Method of threading electrode through EDM guide
Short-term enhancement in CELP speech coding