Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Methods of fabricating a barrier layer with varying composition for copper metallization










Image Number 13 for United States Patent #7863179.

Various embodiments provide improved processes and systems that produce a barrier layer with decreasing nitrogen concentration with the increase of film thickness. A barrier layer with decreasing nitrogen concentration with film thickness allows the end of barrier layer with high nitrogen concentration to have good adhesion with a dielectric layer and the end of barrier layer with low nitrogen concentration (or metal-rich) to have good adhesion with copper. An exemplary method of depositing a barrier layer on an interconnect structure is provided. The method includes (a) providing an atomic layer deposition environment, (b) depositing a barrier layer on the interconnect structure with a first nitrogen concentration during a first phase of deposition in the atomic layer deposition environment. The method further includes (c) continuing the deposition of the barrier layer on the interconnect structure with a second nitrogen concentration during a second phase deposition in the atomic layer deposition environment.








 
 
  Recently Added Patents
Crystal structure of human JAK3 kinase domain complex and binding pockets thereof
Cardiopulmonary resuscitation monitoring apparatus
Tungsten barrier and seed for copper filled TSV
Field emission cathode device and field emission display using the same
Clock face
Communication terminal device, and recording medium
Device with a floating head having a heater element
  Randomly Featured Patents
Suppression of cladding mode loss in fiber amplifiers with distributed suppression of amplified spontaneous emission (ASE)
Curable composition
Recording medium for storing linking type information and method of processing defective area using the same
Amalgam separator
State machine to support concurrent message streams
Recording material
Interface workbench for high volume data buffering and connectivity
Apparatus and method for mounting audio-visual components
Universal edged-based wafer alignment apparatus
Lithographic apparatus and device manufacturing method