Resources Contact Us Home
Substrate processing apparatus

Image Number 6 for United States Patent #7854821.

A substrate processing apparatus includes a heat transfer gas supply mechanism to supply a heat transfer gas through a supply passage into a portion between a worktable and a substrate to improve thermal conductivity between therebetween. Under the control of a control section, the pressure inside the supply passage is measured to obtain a pressure measurement value while the substrate is placed on the worktable. Then, a preparatory flow rate of the heat transfer gas to be supplied through the supply passage into the portion between the worktable and substrate is determined, in accordance with the pressure difference between the pressure measurement value and a pressure reference value, prior to a main process to be performed on the substrate. Then, the heat transfer gas is supplied through the supply passage into the portion between the worktable and substrate at the preparatory flow rate, prior to the main process.

  Recently Added Patents
Blue box
Method and apparatus for producing homogeneous magnetic fields
Method of motion correction in optical coherence tomography imaging
Taste receptors of the T1R family from domestic cat
Method for testing multi-chip stacked packages
Method for fabricating a nitrided silicon-oxide gate dielectric
  Randomly Featured Patents
RF receiver having frequency-hopping/direct-sequence spread spectrum signal discrimination
Methods, devices and reagents for wastewater treatment
Method and device for information retrieval
Ring laser gyroscopes
Optical fibre preform manufacture
Semiconductor package with a metal post and manufacturing method thereof
Enhanced parsing and classification in a packet processor
Paint brush with increased ferrule paint reservoir
Synchronized lamp ballast with dimming
Stereotactic apparatus and methods