Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of forming a contact hole and method of manufacturing a semiconductor device having the same










Image Number 12 for United States Patent #7846825.

In a method of forming a contact hole and a method of manufacturing a semiconductor device having the same, a first insulation interlayer is formed on a substrate. A dummy pattern is formed on the first insulation interlayer. A second insulation interlayer is formed to cover the dummy pattern. A photoresist pattern is formed on the second insulation interlayer. The photoresist pattern has an exposed portion. The dummy pattern under the photoresist pattern is arranged to cross over the exposed portion of the photoresist pattern. The first and second insulation interlayers are etched using the photoresist pattern and the dummy pattern as an etching mask, to form a plurality of contact holes on both sides of the dummy pattern. Accordingly, the contact holes may be formed to have a smaller width.








 
 
  Recently Added Patents
Communication system and data transmission method thereof
Tri-material dual-species neutron spectrometer
Music composition automation including song structure
Method of measuring a displacement amount for an automobile suspension assembly
Social network user data advertising
Spark plug
Driving support device, method, and program
  Randomly Featured Patents
Sealant plug delivery methods
4,7-dioxobenzothiazole-2-carboxamide derivatives, their preparation and their therapeutic uses
Method and apparatus for counterfeiting protection
Method and apparatus for reducing power consumption in a graphics controller
Hanger connector for flexible tubing
Ignition timing controller for an internal combustion engine
Optical disk device and rotation control method
Rear impact occupant protection apparatus and method
Adaptive antenna for reducing multipath fades
Protective shield for electrical components