Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
System and method for performing post-plating morphological Cu grain boundary analysis










Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.








 
 
  Recently Added Patents
Circuit test interface and test method thereof
Polymers and copolymers of ionic liquids as radio frequency absorbing materials
Embedding class hierarchy into object models for multiple class inheritance
Golf bag cart
Retainer
Information processing apparatus, control method, and storage medium
Method and apparatus for validating commands for VOIP network components
  Randomly Featured Patents
Foldable mobile phone
Screening methods for the identification of agents that inhibit SIRT1 Tat deacetylase activity
Component-mounted circuit board production system
Locking device
Rotary series elastic actuator
Subsurface drainage system and drain structure therefor
Tape run control device for microcassette tape recorder
Roller massager
Spread spectrum communication receiver with synchronizing circuit
Aircraft