Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
System and method for performing post-plating morphological Cu grain boundary analysis










Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.








 
 
  Recently Added Patents
Hierarchical binding and lookup of addresses in inter-process communications systems
Memory device and self interleaving method thereof
Assay for the diagnosis of flaviviral infection using antibodies with high affinity for NS1 protein of flavivirusi in hexameric form
Stool
Organic dual-gate memory and method for producing same
Forming agent for gate insulating film of thin film transistor
Digital display
  Randomly Featured Patents
Continuous casting apparatus for slabs
Method and apparatus for cooling fish on board a ship
Auto-activation of fonts
Hoist
LED package with converging optical element
Sliding valve aspiration
Method and apparatus for tier forming on a row by row basis
Chat system displaying a link arrow directed from a hyperlink to content of an associated attachment file
Redirection of cellular immunity by receptor chimeras
N-carboxymethyl substituted lysyl and .alpha.-(.epsilon.-aminoalkyl) glycyl amino acid antihypertensive agents