Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
System and method for performing post-plating morphological Cu grain boundary analysis










Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.








 
 
  Recently Added Patents
Front face of a vehicle wheel
ASICs having programmable bypass of design faults
Light transformation particle and photobioreactor
Personalized location information for mobile devices
High voltage circuit for electrical stimulation
Tetrazolyl oxime derivative, salt thereof, and plant disease control agent
Operation controlling apparatus
  Randomly Featured Patents
Combined broom, brush and dustpan
Semiconductor device having semiconductor element becomes operable when connected to external power source
Method of and apparatus for in-situ measurement of changes in fluid composition by electron spin resonance (ESR) spectrometry
Method for controlling an automated clutch system
Method for securing a spare tire
Controller for permanent magnet synchronous motor
Dial controller
Refrigerator having a cooled-air passageway formed with an external surface of a liner
Bridges for providing access from a water-borne craft to the shore
Stove