Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
System and method for performing post-plating morphological Cu grain boundary analysis










Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.








 
 
  Recently Added Patents
Controller for flexible and extensible flow processing in software-defined networks
Method and apparatus for managing network traffic
Optical modulator module
Image sensor and method for fabricating the same
Damage resistant antenna
Imaging apparatus, control method thereof, and program
Method and apparatus for encoding and decoding video based on first sub-pixel unit and second sub-pixel unit
  Randomly Featured Patents
Hypodermic syringe with parts disposable after use
Differential gear transmission type work units positioning system
Packet processing with adjusted access control list
Figure toy
Pneumatic radial tires for truck and bus mounted on 15.degree. drop center rim
Infrared sensing device outputting blue-green light
Multi-functional beverage storage rack for a refrigerator
Monoazo dispersed dye and mixtures containing them and the preparation and use thereof
Cordless telephone
Defect classification with optimized purity