Resources Contact Us Home
System and method for performing post-plating morphological Cu grain boundary analysis

Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.

  Recently Added Patents
Matching engine for comparing data feeds with user profile criteria
Method for forming pattern
Portion of a display panel with an unhappy facial expression icon
Time sharing type autostereoscopic display apparatus and method for driving the same
Housing for gas flow indicator
Television receiver
Determining system for localization methods combination
  Randomly Featured Patents
Methods of making radiolabeled tracers and precursors thereof
System for attaching an article to a roof and method of use
Arrangement for reducing power dissipation in a line driver
Operation housing for automobile battery charger
Open-end spinning machines
Skin remover
Computer front bezel
Maize variety hybrid 10157970
Detecting and differentiating SATA loopback modes
Methods of patterning radiation, methods of forming radiation-patterning tools, and radiation-patterning tools