Resources Contact Us Home
System and method for performing post-plating morphological Cu grain boundary analysis

Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.

  Recently Added Patents
Gyroscope utilizing torsional springs and optical sensing
Device for determining the absolute angular position of the steering wheel of an electric power-assisted steering column of a motor vehicle using weighted dynamic parameters of the vehicle
Bread basket
Native NAD-dependent GAPDH replaced with NADP-dependent GAPDH plus NADK
Semiconductor device and manufacturing method thereof
Face recognition through face building from two or more partial face images from the same face
Supplier capability methods, systems, and apparatuses for extended commerce
  Randomly Featured Patents
Method for the manufacture of bundles of metal sheets of annular shape
Systems and methods for measuring properties of conductive layers
Method of undercutting micro-mechanical device with super-critical carbon dioxide
Tropyl derivatives
Multi-cycle programmable processor with FSM implemented controller selectively altering functional units datapaths based on instruction type
Adjusting device for the point of articulation or the point of deflection of a safety belt
Aqueous magnetorheological material
Method for treating ischemia using polypeptides with fibronectin activity
Suspension device for a perambulator, comprising a composite strip of variable stiffness
Pulse width modulation pulse shaper