Resources Contact Us Home
System and method for performing post-plating morphological Cu grain boundary analysis

Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.

  Recently Added Patents
Method to alter silicide properties using GCIB treatment
System and method of verification of analog circuits
Message transfer apparatus, output method, and computer program product
Sacrificial spacer approach for differential source/drain implantation spacers in transistors comprising a high-k metal gate electrode structure
Image capture and identification system and process
Method and system for providing an intelligent visual scrollbar position indicator
Die packages and systems having the die packages
  Randomly Featured Patents
Method and apparatus for diagnosing a cyclic system
Capacitive sensing in user interface and motion control for a child motion device
Basking buoy for turtles and amphibians
Method of making self-aligned field-effect transistor
Apparatus for increasing truck bed cargo space
Auxiliary drive for the ductor roller of a sheet-fed offset press
Child resistant closure
Scanning microscopy
Process cartridge, image forming apparatus and method of assembling process cartridges
Intermittent detection during analytical reactions