Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
System and method for performing post-plating morphological Cu grain boundary analysis










Image Number 9 for United States Patent #7844101.

Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.








 
 
  Recently Added Patents
Method for delivering a volatile material
Temporary protective cover for an exposed junction box
Method and system for using personal devices for authentication and service access at service outlets
Display screen with graphical user interface
Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and electronic apparatus
Snapshot isolation support for distributed query processing in a shared disk database cluster
Data-conditioned encryption method
  Randomly Featured Patents
ATM switch which counts multicast cell copies and uses a second memory for a decremented cell count value
Lighting inspection device for plasma display panel and display panel producing method
Microwave oven
Niobium powder for capacitor, sintered body using the powder and capacitor using the same
Electromagnetic drive circuitry for anhysteretic duplication of a flexible magnetic disk
Conveyor accelerator system
Method and system for auctioning bankruptcy assets and valuing same
Multi-point locking system
Electric power tool
Freeze-dried composition containing a 2-dimethylamino etoposide derivative