Resources Contact Us Home
Electronic device package and method of manufacturing the same

Image Number 5 for United States Patent #7838333.

The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

  Recently Added Patents
Device and method for producing a fluidic connection between cavities
Rose plant named `Esm R068`
Resistive memory element sensing using averaging
Air filter
Systems and methods for computer-aided fold detection
Weak acid recovery system for ethanol separation processes
Projection illumination system for EUV microlithography
  Randomly Featured Patents
Cavity scope
Bending method of medical suturing needle
Miticidal mixtures and method utilizing a macrotetrolide compound
Surface functionalized diamond crystals and methods for producing same
Digital broadcasting system and digital video recording/reproducing apparatus
Circuit protection device
Electronic apparatus
Ion beam machining techniques and apparatus
Embolic coil implant system and implantation method
Electrographic recording medium with conductive layer containing metal oxide semiconductor