Resources Contact Us Home
Electronic device package and method of manufacturing the same

Image Number 10 for United States Patent #7838333.

The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.

  Recently Added Patents
Method and apparatus for exercise monitoring combining exercise monitoring and visual data with wireless internet connectivity
Unified recovery
Pet burial pod
Extensible, filtered lists for mobile device user interface
Soybean variety XB51J12
DRAM refresh method and system
Antitumoral compounds
  Randomly Featured Patents
Bifurcated wrap-around covering
Long range multiple point wireless control and monitoring system
Solar-powered trash compactor
Air cleaner
Cooling system and method for cooling a heat producing system
Method and apparatus for navigating with correction of angular speed using azimuth detection sensor
Position sensor apparatus and method
Exhaust gas turbocharger for an internal combustion engine
Semiconductor circuit device having active and standby states