Resources Contact Us Home
Variable volume plasma processing chamber and associated methods

Image Number 14 for United States Patent #7824519.

A plasma processing chamber includes a substrate support having a top surface defined to support a substrate in a substantially horizontal orientation within the chamber. The plasma processing chamber also includes a number of telescopic members disposed within the chamber outside a periphery of the substrate support. The number of telescopic members are also disposed in a concentric manner with regard to a center of the top surface of the substrate support. Each of the number of telescopic members is defined to be independently moved in a substantially vertical direction so as to enable adjustment of an open volume above the top surface of the substrate support, and thereby enable adjustment of a plasma condition within the open volume above the top surface of the substrate support.

  Recently Added Patents
3D solid-state arrangement for solid state memory
Personalized location information for mobile devices
Generating and using checkpoints in a virtual computer system
Method for cutting C--Mn steel with a fiber laser
Method for manufacturing thin film transistor and method for manufacturing display device
System and method for stranded file opens during disk compression utility requests
Signal activated molecular delivery
  Randomly Featured Patents
Apparatus and method for wrapping bundles of newspapers or the like
Horizontal electrophoresis or isoelectric focusing apparatus and method of using same
Coupled resonator bulk acoustic wave filter
Reactor coolant pump having double dam seal with self-contained injection pump mechanism
Electronic still camera
Method and system for drop guides for visual layout in Java layout managers
Lever mechanism
Pull-on disposable diaper
Casket lid end cap
Small animal shelter