Resources Contact Us Home
Variable volume plasma processing chamber and associated methods

Image Number 14 for United States Patent #7824519.

A plasma processing chamber includes a substrate support having a top surface defined to support a substrate in a substantially horizontal orientation within the chamber. The plasma processing chamber also includes a number of telescopic members disposed within the chamber outside a periphery of the substrate support. The number of telescopic members are also disposed in a concentric manner with regard to a center of the top surface of the substrate support. Each of the number of telescopic members is defined to be independently moved in a substantially vertical direction so as to enable adjustment of an open volume above the top surface of the substrate support, and thereby enable adjustment of a plasma condition within the open volume above the top surface of the substrate support.

  Recently Added Patents
Watch dial
Side portion of a circular saw blade
Inspection tool for top guides of a boiling water reactor
Optoelectronic semiconductor chip comprising a reflective layer
Pyrrolidine-1,2-dicarboxamide derivatives
Transferring a document
Online data conversion technique using a sliding window
  Randomly Featured Patents
Method for forming interlayer dielectric film
LED lamp for light source and method
Optical disk containers
Multi-chip antenna diversity picture-in-picture architecture
Fabric reinforced tubular rubber bladders and method of making same
Silylated poly(vinyl)phenol polymers
Integrin blocking molecule
Back-up warning system for a vehicle and related method
Photoelectrophoretic imaging method producing a desired image border
Automatic focus control motive means