Resources Contact Us Home
Variable volume plasma processing chamber and associated methods

Image Number 14 for United States Patent #7824519.

A plasma processing chamber includes a substrate support having a top surface defined to support a substrate in a substantially horizontal orientation within the chamber. The plasma processing chamber also includes a number of telescopic members disposed within the chamber outside a periphery of the substrate support. The number of telescopic members are also disposed in a concentric manner with regard to a center of the top surface of the substrate support. Each of the number of telescopic members is defined to be independently moved in a substantially vertical direction so as to enable adjustment of an open volume above the top surface of the substrate support, and thereby enable adjustment of a plasma condition within the open volume above the top surface of the substrate support.

  Recently Added Patents
Nonvolatile semiconductor memory device
Image forming unit having agitating portion and image forming apparatus
Externally gapped line arrester
Moving structure and micro-mirror device using the same
Antenna array system
Authenticating and off-loading IPTV operations from mobile devices to fixed rendering viewing devices
Storage device having clock adjustment circuitry with firmware-based predictive correction
  Randomly Featured Patents
Apparatus for measuring the position of weft threads in a moving fabric web
Method of and apparatus for treating wood chips
Wideband balun for wireless and RF application
Apparatus for supporting a machine tool on a robot arm
Cutting tool
Polyesters of 1,2-bis(hydroxyphenyl)ethanes and aromatic dicarboxylic acids
Chassis for grass treatment machine
Cathode ray tube meters
Method and structure to reduce contact resistance on thin silicon-on-insulator device
Intermediate portion of a breakdown rifle