Resources Contact Us Home
Method of fabricating metal interconnects and inter-metal dielectric layer thereof

Image Number 3 for United States Patent #7795131.

A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.

  Recently Added Patents
Liquid crystal display device and method of manufacturing the same
Diagnostic system for the detection of skin cancer
Method for electronically controlling a bicycle gearshift and electronically servo-assisted bicycle gearshift
Ramping pass voltage to enhance channel boost in memory device
Method and system for providing information for identifying callers
Impedance matching circuit capable of efficiently isolating paths for multi-band power amplifier
Gripping cover for grab bar
  Randomly Featured Patents
Container for household waste materials
Solderless pin connection
Method and apparatus for selectively locking a system password of a computer system
Truck stake arrangement
Watch casing and bezel
Coronary angiography imaging system
Operation button mounting structure, and image forming apparatus and electronic apparatus equipped with the same
Sales data transmission system
Puncture safe needle assembly