Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of fabricating metal interconnects and inter-metal dielectric layer thereof










Image Number 3 for United States Patent #7795131.

A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.








 
 
  Recently Added Patents
Barrier layers comprising Ni-inclusive ternary alloys, coated articles including barrier layers, and methods of making the same
Sweetener compositions having enhanced sweetness and improved temporal and/or flavor profiles
Invisible fence battery charger
Personalized dashboard architecture for displaying data display applications
Wireless communication system, associated methods and data structures
Wireless communication apparatus, a method of wireless communication, and a program for wireless communication
Charging current control method and charging system
  Randomly Featured Patents
Variable valve device for an internal combustion engine
Voice command remote control system
Stacked rotary connector assembly using a split ring configuration
Flexible mounting hub for disc member
Herbicidal sulfonamides
Fault handling and recovery for system having plural processors
Method for recovery of catalyst components
Barrier against crawling arthropods
Method and system for providing an NFT using a sacrificial NFT structure
Use of a radial zone coating to facilitate a two-stage prox system with single air injection