Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of fabricating metal interconnects and inter-metal dielectric layer thereof










Image Number 3 for United States Patent #7795131.

A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.








 
 
  Recently Added Patents
Sensor apparatus and information processing apparatus
Display screen with graphical user interface
Tailoring the band gap of solar cells made of liquid silane by adding germanium
In-vehicle electronic control apparatus having monitoring control circuit
System and method for supporting fibre channel over ethernet communication
Pull through coronary sinus pacing lead
Representations of compressed video
  Randomly Featured Patents
Hydroxamates as therapeutic agents
Suspension system for trailer
Chipset security offload engine
Apparatus for traversing a terrain in a predetermined pattern
Nozzle for use in continuous casting
Reactive dye mixtures
Low VOC epoxy silane oligomer and compositions containing same
Process for the preparation of N-acyl-N-alkyl-2,6-dialkyl-3-chloroanilines
Apparatus for defiberizing, screening and pumping cellulose pulp or recycled paper
Putter and golf ball deformity measuring apparatus