Resources Contact Us Home
Method of fabricating metal interconnects and inter-metal dielectric layer thereof

Image Number 3 for United States Patent #7795131.

A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.

  Recently Added Patents
Optical imaging device and imaging method for microscopy
Superconducting magnetizer
Powerline communication receiver
Fluorescent molecule and method for detecting target nucleic acid
Developing device
Method for detection and characterization of a microorganism in a sample using time-dependent intrinsic fluorescence measurements
Method and systems for detecting duplicate travel path
  Randomly Featured Patents
Method of iron smelting in blast furnace with high temperature coal Gas
Multiantenna receiving device
Combination door lock and alarm
Push-to-talk communication management system
Fishing reel controller
Tube cutter
Control device for in-wheel transmissions in an electric vehicle
Rotary electric switch
Driving voltage generating circuit and display device including the same
Light-sensitive material containing silver halide, reducing agent and polymerizable compound