Resources Contact Us Home
Method of fabricating metal interconnects and inter-metal dielectric layer thereof

Image Number 3 for United States Patent #7795131.

A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.

  Recently Added Patents
Medical capsule housing formed by thermal welding
Powder pulverising device
Providing a web page to a client
Method and apparatus for user selection of advertising combinations
Media processing method and device
Dimmable LED light fixture having adjustable color temperature
Atmospheric treater with roller confined discharge chamber
  Randomly Featured Patents
Method of making an IGFET with a multilevel gate
Screen and shelving system
Air baggage tag
Multibeam lens antennas
Method for interrupting the force flux in the drive train of a vehicle in the event of a crash
Roller mill control system
Method for producing halosilanes by impinging microwave energy
Winding device for a yarn, in particular for a yarn with approximately zero elongation
Human T cell reactive feline protein (TRFP) isolated from house dust and uses therefor
Apparatus and method for capacitive measurement of materials