Resources Contact Us Home
Method of fabricating metal interconnects and inter-metal dielectric layer thereof

Image Number 3 for United States Patent #7795131.

A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.

  Recently Added Patents
Video surveillance system employing video primitives
Enhancing user experiences using aggregated device usage data
Wire guide
Electrophotographic photoreceptor and image forming apparatus including the same
Cancer vaccines containing epitopes of oncofetal antigen
Architectural panel with Tarwe and grass
Latch-up free ESD protection
  Randomly Featured Patents
Behavioral learning for a visual representation in a communication environment
System for authenticating digital data
Open loop compensation circuit
Method of forming a non-tunable head
High clarity emulsions containing high melt viscosity maleated polypropylene wax
Complementary junction-narrowing implants for ultra-shallow junctions
Carrier gas system and coupling substrate carrier to a loadport
Protecting information in a system
Internet shopping system utilizing set top box and voice recognition
Method and apparatus for installing silt fence