Resources Contact Us Home
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Image Number 10 for United States Patent #7791186.

A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.

  Recently Added Patents
Decision management system and method
Charged-particle beam lens
Shallow trench media
Nuclear fuel assembly bottom nozzle
SRB enhancement on HS-DSCH during cell change
Antimony and germanium complexes useful for CVD/ALD of metal thin films
Receiving security risk feedback from linked contacts due to a user's system actions and behaviors
  Randomly Featured Patents
Ink jet recording head cartridge
5-(Dioxabicyclohept-6-yl)-cyclohexenone oxime ethers, and the preparation and thereof use
Systems and methods to remove liquid product and fines from a slurry reactor
Door hinge
Base-point anchor
Resistance training apparatus for squat exercises
Adaptive packet compression apparatus and method
Method and system for ranking words and concepts in a text using graph-based ranking
Fabric having a removable guide
Integrated memory circuit having a high-voltage switch