Resources Contact Us Home
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Image Number 10 for United States Patent #7791186.

A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.

  Recently Added Patents
Method, apparatus and article for detection of transponder tagged objects, for example during surgery
Composition comprising a mixture of dextro- and levo-amphetamines complexed with ion-exchange resin particles to form drug resin particles
Photovoltaic system with integrated photovoltaic panel and battery
Scoring users of network based users
Method and system for shared high speed cache in SAS switches
LED-array package
Methods to fabricate a photoactive substrate suitable for microfabrication
  Randomly Featured Patents
Apparatus for continuous heat treating advancing continuously formed pipe in a restricted space
Distributed network computing system for data exchange/conversion between terminals
Pumper bumper
Endotoxin detoxifying material
System and method for conducting BIST operations
Capacity control for multi-stage compressors
Polyacrylonitrile filament yarns
Formaldehyde stabilized coating compositions
Method of constructing model of recognizing english pronunciation variation
Portable gas cooking stove