Resources Contact Us Home
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Image Number 10 for United States Patent #7791186.

A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.

  Recently Added Patents
Portable electronic device housing including hinge
Tire for motorcycle
Solar cell with hyperpolarizable absorber
Electronic currency, electronic wallet therefor and electronic payment systems employing them
Methods and systems for dynamic spectrum arbitrage
Methods and apparatus for intelligent selection of goods and services in mobile commerce
Communication apparatus, and method and program for controlling same
  Randomly Featured Patents
Crossing spiral compressor/pump
Optically active anthracycline glycosides A and B
Nail clipper receptacle
Filing case having removable, expanding file
Blood withdrawal system
Method and system for quality of service (QoS) monitoring for wireless devices
Method of using the UNIX physio to allow data to be transferred on a plurality of channels concurrently
Semicustom IC having adjacent macrocells
Apparatus for applying strips to cards