Resources Contact Us Home
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Image Number 10 for United States Patent #7791186.

A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.

  Recently Added Patents
Isolated SCR ESD device
Methods and system for providing drug pricing information from multiple pharmacy benefit managers (PBMs)
Micro vein enhancer
Lighting elements
System and method for configuring a direct lift control system of a vehicle
Providing multiple decode options for a system-on-chip (SoC) fabric
  Randomly Featured Patents
Process for preventing caking and obtaining flowability of alkali chlorides and salt mixtures thereof
Stock wedge shoe
Automatic transmission control system for vehicle
Collapsible window flange apparatus
Perfume container
Life extending circuit for storage batteries
Equipment support pad
Continuous signature stacker machine provided with special device for transversely ejecting the assembled package
Method for producing silicon thin-film transistors with enhanced forward current drive