Resources Contact Us Home
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Image Number 10 for United States Patent #7791186.

A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.

  Recently Added Patents
System and method for merging security constraints when using security annotations
Garment with lumbar traction device
Wood preservation
Air filter and air filter system
Control layer indexed playback
Method for manufacturing a semiconductor device
Watch and accessory band
  Randomly Featured Patents
Exhaust gas sensor and process for producing same
Self-terminating coaxial connector
Game apparatus
System and method for multicurrency and multibank processing over a non-secure network
Methods for treating a fractured and/or diseased and/or weakened bone
Combination card and tape recorder
Line memory in which reading of a preceding line from a first memory and writing of a current line to a second memory are performed in the same time period
Dynamic timing adjustment in a circuit device
HIV antisense proteins
Methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies