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Method of forming stack layer and method of manufacturing electronic device having the same










Image Number 4 for United States Patent #7700269.

A method of forming a stacked structure in an electronic device, where a photoresist for performing multi-patterning processes is used. Also, a method of manufacturing a FED in which different structures can be multi-patterned by using a single photoresist mask. The photoresist has a solubility to a solvent by heat-treatment after exposure, and a complicated structure can be formed using the photoresist.








 
 
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