Resources Contact Us Home
Method for bonding substrates and method for irradiating particle beam to be utilized therefor

Image Number 3 for United States Patent #7686912.

A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.

  Recently Added Patents
Frame syncrhonization in orthogonal frequency-division multiplexing systems
Self-service administration of a database
Content protection apparatus and content encryption and decryption apparatus using white-box encryption table
Systems and methods of using dynamic data for wear leveling in solid-state devices
Table base
Reliability fire pressure switch
Method of interfacing a host operating through a logical address space with a direct file storage medium
  Randomly Featured Patents
Optical imaging using time gated scattered light
Fibre-optic connector
Fuel pump nozzle anti dribble device
Superconducting magnetic resonance imaging magnet assembly and method with reverse wire channel orientation
Accurate correlator of rotational and translational motions and control method and apparatus
Order-based material management system
Retractable blade cutting apparatuses and methods for mowing machines
Magnetically guided atherectomy
Magnetic wedge and the process of making said wedge
Electrostatic spraying of a cosmetic composition