Resources Contact Us Home
Method for bonding substrates and method for irradiating particle beam to be utilized therefor

Image Number 3 for United States Patent #7686912.

A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.

  Recently Added Patents
Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package
Clock face
Rear body panel cover for a motor vehicle
Reserving a time block in a calendar application to account for a travel time between geographic locations of appointments
Handover signaling in wireless networks
Connector interface for a cable
Dynamic learning method and adaptive normal behavior profile (NBP) architecture for providing fast protection of enterprise applications
  Randomly Featured Patents
Explosion-proof semiconductor device
Collapsible hammock stand
System method and computer program product for dynamically sizing hash tables
Door assembly
Portable electronic device recharger
Method and device for selecting a communication path
Method for determining load size and/or setting water level in a washing machine
Tilt-up/jack-up off-shore drilling apparatus and method
Ion exchange modified with mercapto amines