Resources Contact Us Home
Method for bonding substrates and method for irradiating particle beam to be utilized therefor

Image Number 3 for United States Patent #7686912.

A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.

  Recently Added Patents
Resin composition and display device using the same
Nonvolatile semiconductor memory device
Per-request control of DNS behavior
Round carrying case
Method and system for coding an information signal using closed loop adaptive bit allocation
System and method for customized prompting
Apparatus and sensor for adjusting vertical sensor-alignment
  Randomly Featured Patents
Anti-freeze arrangement for sprinkler systems
Aircraft shock strut having fixed upper bearing
Aircraft with magnetically coupled annulus
Video game apparatus with automatic skill level adjustment
Control valve
Contact strip
Tag attaching machine
Adjustable weight dumbell
Pet dish stand
Inflatable prosthetic device for lining a body duct