Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for bonding substrates and method for irradiating particle beam to be utilized therefor










Image Number 3 for United States Patent #7686912.

A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.








 
 
  Recently Added Patents
Pausing a VoiceXML dialog of a multimodal application
Quantifying the risks of applications for mobile devices
Gathering user feedback in web applications
Phosphoinositide 3-kinase inhibitor with a zinc binding moiety
Identification of electrical grid phase information for end-points in a grid network
Probe card holding apparatus with probe card engagement structure
Analysis device and an analysis apparatus using the analysis device
  Randomly Featured Patents
Access point having at least one or more configurable radios
Cover for light and/or fragrance emitter
Optimal channel design for memory devices for providing a high-speed memory interface
1/4 size real time decoding of digital video
Thermally efficient micromachined device
Electronic circuit unit suitable for miniaturization
Active differential to single-ended converter
Semiconductor device including a wiring layer having a non-doped or high resistivity polycrystal silicon portion
Whole house fan
Apparatus for driving rollers in roller hearth kiln