Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for bonding substrates and method for irradiating particle beam to be utilized therefor










Image Number 3 for United States Patent #7686912.

A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.








 
 
  Recently Added Patents
Eyeglasses
Compositions and methods for inhibition of MMP13:MMP-substrate interactions
Resonant conversion system with over-current protection processes
Stepped delay control of integrated switches
Fire detector
Bluetooth headset
System and method for oscillator frequency control
  Randomly Featured Patents
Current limiting circuit
Method and system for performing real-time operation
Electrochemical cell system with side-by-side arrangement of cells
Food processors
Control method for message communication in network supporting software emulated modules and hardware implemented modules
Radiographic image reader
High density ethylene homopolymers and blend compositions
Electrophotoconductive Cd S Se materials with Cu and Cl
Analyzing for alkyl ketene dimers
Azinoneutromethines