Resources Contact Us Home
Apparatus and method for preventing copper peeling in ECP

Image Number 3 for United States Patent #7667835.

An apparatus and method for preventing the peeling of electroplated metal from a wafer, is disclosed. The apparatus includes a seed layer detector system having a light source and a reflectivity detector. According to the method, the light source emits a beam of light onto a wafer and the reflectivity detector receives the light reflected from the wafer. The reflectivity of the wafer surface is measured to determine the presence or absence of a seed layer on the wafer, as well as whether the seed layer has a minimum thickness for optimum electroplating of a metal onto the seed layer.

  Recently Added Patents
Storage apparatus and method including page discard processing for primary and secondary volumes configured as a copy pair
Dynamic facsimile transcoding in a unified messaging platform
Apparatus for generating electrical energy from rocking activated energy
Methods, systems and computer program products for importing data from an edge router to a network management system
LED drive circuit
System and method for infrared dongle
Silicas and alkali metal salt compositions, detergents formed from such compositions and method of forming such compositions and detergents
  Randomly Featured Patents
Bright and dark field switching device and microscope
System for casting a metal article using a fluidized bed
Information display device
Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making
Recessed furnace lance purge gas system
Card connector with ejection damper
Foundation waterproofing and drainage system
Energy-absorbing system for vehicle door assembly
Inbred corn line 4XA321
Reflector system