Resources Contact Us Home
Wire-type semiconductor devices and methods of fabricating the same

Image Number 6 for United States Patent #7663166.

Provided are relatively higher-performance wire-type semiconductor devices and relatively economical methods of fabricating the same. A wire-type semiconductor device may include at least one pair of support pillars protruding above a semiconductor substrate, at least one fin protruding above the semiconductor substrate and having ends connected to the at least one pair of support pillars, at least one semiconductor wire having ends connected to the at least one pair of support pillars and being separated from the at least one fin, a common gate electrode surrounding the surface of the at least one semiconductor wire, and a gate insulating layer between the at least one semiconductor wire and the common gate electrode.

  Recently Added Patents
Display screen of a mobile terminal or portion thereof with a graphical user interface
Gas sensor with a porous layer that detectably affects a surface lattice resonant condition of a nanoparticle array
Apparatus and method for multiple pagings in broadband wireless communication system
Probiotic enriched and low organic acid food products
Apparatus for preventing overcharge of a battery
Optical splitter device
  Randomly Featured Patents
Novel hydrazinocarboxamide derivatives and preparation thereof
Method for applying a coating material and coating for a metallic surface
Variable capacitor with wobble motor disc selector
Method of playing a match game
Applying flux to a solder wave for wave soldering an element
Head stabilizer for equestrian jumping
Method and apparatus for automatically re-validating multiple clients of an authentication system
Active messaging system and method
System and method for generating computed tomography images
Radiant energy collecting or emitting element and method and tool for manufacture thereof