Resources Contact Us Home
Wire-type semiconductor devices and methods of fabricating the same

Image Number 13 for United States Patent #7663166.

Provided are relatively higher-performance wire-type semiconductor devices and relatively economical methods of fabricating the same. A wire-type semiconductor device may include at least one pair of support pillars protruding above a semiconductor substrate, at least one fin protruding above the semiconductor substrate and having ends connected to the at least one pair of support pillars, at least one semiconductor wire having ends connected to the at least one pair of support pillars and being separated from the at least one fin, a common gate electrode surrounding the surface of the at least one semiconductor wire, and a gate insulating layer between the at least one semiconductor wire and the common gate electrode.

  Recently Added Patents
Optoelectronic semiconductor chip and method for manufacturing a contact structure for such a chip
Liquid crystal display backlight control
Systems and methods for implementing pressure sensitive keyboards
Geo-coding images
Method and apparatus for a battery docking connector having reserve power for hot battery swap
Providing policy-based operating system services in an operating system on a computing system
Gangable electrical box and leveling assembly
  Randomly Featured Patents
Office-line trunk circuit operating on ground-start and loop-start modes, method of controlling same, and control program for same
Toy parachute and release mechanism
Method of forming a shallow and high conductivity boron doped layer in silicon
Time-shared latency locked loop circuit for driving a buffer circuit
Automatic display video positioning and scaling system
System and method for microstrain measurement
Process for the manufacture of thianthrene
Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer
Electric discharge tube