Resources Contact Us Home
Wire-type semiconductor devices and methods of fabricating the same

Image Number 13 for United States Patent #7663166.

Provided are relatively higher-performance wire-type semiconductor devices and relatively economical methods of fabricating the same. A wire-type semiconductor device may include at least one pair of support pillars protruding above a semiconductor substrate, at least one fin protruding above the semiconductor substrate and having ends connected to the at least one pair of support pillars, at least one semiconductor wire having ends connected to the at least one pair of support pillars and being separated from the at least one fin, a common gate electrode surrounding the surface of the at least one semiconductor wire, and a gate insulating layer between the at least one semiconductor wire and the common gate electrode.

  Recently Added Patents
Frame timing synchronization in a geostationary satellite system
Systems and methods of device-free motion detection and presence detection
Managing personal information on a network
Methods and apparatus to provide haptic feedback
Integrated circuit packaging system with an encapsulation and method of manufacture thereof
Event handling in an integrated execution environment
Differential ring oscillator and method for calibrating the differential ring oscillator
  Randomly Featured Patents
Digital switching system with shared analog line
Phased array laser scanner
Reflector and backlight device
Garment having an apparent elastic band
Magnetic fluid sealing device
Climate control for vehicle
Liquid ejecting head and ink jet printing apparatus
Waveguide-type semiconductor optical modulator and method for manufacturing the same
Reference magnetic signal recording device and method of manufacturing the same
Method of manufacturing a semiconductor device having a layer of polymide resin